Currently there is no automated deposition system available for support materials in Ultrasonic Consolidation. Support materials are important to the UC technology because of the benefits that can be geometrically achieved. Without an integrated support materials system many geometries and features will be impossible to create. This paper describes the approach taken to integrate UC and FDM in order to automatically deposit materials as a support in a UC machine. This includes the process setup, design, and planning. Finally a build process integrating the two machines is shown to demonstrate that automated support material deposition in UC is possible.Mechanical Engineerin
Ultrasonic consolidation (UC) is a process whereby metal foils can be metallurgically bonded at or n...
Over the last three decades, developments within the area of Additive Manufacturing (AM) have result...
Ultrasonic Consolidation (UC) is a promising solid state rapid manufacturing process that provides t...
Currently there is no automated deposition system available for support materials in Ultrasonic Con...
Support materials play a vital role across the entire field of additive manufacturing (AM) technolog...
This paper provides an overview of the need for supports and what characterizes a good support mate...
A research project is underway to integrate an nScrypt Smart PumpTM 100 direct write nozzle with a ...
Ultrasonic consolidation (UC) is a novel, solid-state, additive manufacturing fabrication process. ...
Ultrasonic Consolidation (UC) is a manufacturing technique based on the ultrasonic metal welding of ...
Ultrasonic Consolidation (UC) is a solid state additive manufacturing process which fabricates three...
Development of a flexible and mobile fused deposition modeling (FDM) system from an existing FDM sys...
Ultrasonic consolidation (UC) is a process whereby metal foils can be metallurgically bonded at or ...
Ultrasonic consolidation (UC) is a solid state rapid manufacturing process derived from ultrasonic w...
Ultrasonic consolidation (UC) is a recently developed direct metal solid freeform fabrication proce...
Fused deposition modeling (FDM) is an additive manufacturing (AM) process that has been used in vari...
Ultrasonic consolidation (UC) is a process whereby metal foils can be metallurgically bonded at or n...
Over the last three decades, developments within the area of Additive Manufacturing (AM) have result...
Ultrasonic Consolidation (UC) is a promising solid state rapid manufacturing process that provides t...
Currently there is no automated deposition system available for support materials in Ultrasonic Con...
Support materials play a vital role across the entire field of additive manufacturing (AM) technolog...
This paper provides an overview of the need for supports and what characterizes a good support mate...
A research project is underway to integrate an nScrypt Smart PumpTM 100 direct write nozzle with a ...
Ultrasonic consolidation (UC) is a novel, solid-state, additive manufacturing fabrication process. ...
Ultrasonic Consolidation (UC) is a manufacturing technique based on the ultrasonic metal welding of ...
Ultrasonic Consolidation (UC) is a solid state additive manufacturing process which fabricates three...
Development of a flexible and mobile fused deposition modeling (FDM) system from an existing FDM sys...
Ultrasonic consolidation (UC) is a process whereby metal foils can be metallurgically bonded at or ...
Ultrasonic consolidation (UC) is a solid state rapid manufacturing process derived from ultrasonic w...
Ultrasonic consolidation (UC) is a recently developed direct metal solid freeform fabrication proce...
Fused deposition modeling (FDM) is an additive manufacturing (AM) process that has been used in vari...
Ultrasonic consolidation (UC) is a process whereby metal foils can be metallurgically bonded at or n...
Over the last three decades, developments within the area of Additive Manufacturing (AM) have result...
Ultrasonic Consolidation (UC) is a promising solid state rapid manufacturing process that provides t...