This paper examines the influence of the elastic modulus and applied contact pressure on the tangential AC breakdown strength (BDS) of polymer solid-solid interfaces theoretically and experimentally. In the experiments, three different materials with different elastic moduli, namely cross-linked polyethylene (XLPE), the cured end product of epoxy resin (EPOXY), and polyether ether ketone (PEEK) were employed under various contact pressures. The BDS of each interface increased as the contact pressure was augmented. As the contact pressure became threefold, the interfacial BDS rose by a factor of 2.4, 1.7, and 1.8 in the case of the PEEK, EPOXY, and XLPE interface in a sequence following the decrease of the elastic modulus. Under the same con...
Interfaces between different solid dielectric materials often exhibit lower breakdown strength when ...
Usage of cable systems has increased during the last decades both for AC and DC solutions. To make t...
Interfaces between solid dielectric materials may exhibit lower breakdown strength compared to that ...
Solid-solid interfaces between insulating materials dictate the long-term electrical properties of t...
The interfacial breakdown between two dielectric surfaces was reported to represent one of the leadi...
Solid-solid interfaces between insulating materials dictate the long-term electrical properties of t...
Insulation systems incorporating multilayer dielectrics are commonly used in many high-voltage appli...
The contact area between solid insulations, namely solid-solid interfaces, affect the dielectric cha...
The interfacial breakdown between two dielectric surfaces has been reported to represent one of the ...
The primary purpose of this paper is to study the influence of the surface roughness and interfacial...
One of the most important causes of insulation system failure is the breakdown of the interface betw...
In several electrical insulation components, such as cable connectors, joints and penetrators, vario...
Morphology of the contact area between solid insulation materials ultimately determines the short- a...
In several electrical insulation components, such as cable connectors, joints and penetrators, vario...
This research work is a part of an on-going project at NTNU/SINTEF-Energy Research aim- ing at devel...
Interfaces between different solid dielectric materials often exhibit lower breakdown strength when ...
Usage of cable systems has increased during the last decades both for AC and DC solutions. To make t...
Interfaces between solid dielectric materials may exhibit lower breakdown strength compared to that ...
Solid-solid interfaces between insulating materials dictate the long-term electrical properties of t...
The interfacial breakdown between two dielectric surfaces was reported to represent one of the leadi...
Solid-solid interfaces between insulating materials dictate the long-term electrical properties of t...
Insulation systems incorporating multilayer dielectrics are commonly used in many high-voltage appli...
The contact area between solid insulations, namely solid-solid interfaces, affect the dielectric cha...
The interfacial breakdown between two dielectric surfaces has been reported to represent one of the ...
The primary purpose of this paper is to study the influence of the surface roughness and interfacial...
One of the most important causes of insulation system failure is the breakdown of the interface betw...
In several electrical insulation components, such as cable connectors, joints and penetrators, vario...
Morphology of the contact area between solid insulation materials ultimately determines the short- a...
In several electrical insulation components, such as cable connectors, joints and penetrators, vario...
This research work is a part of an on-going project at NTNU/SINTEF-Energy Research aim- ing at devel...
Interfaces between different solid dielectric materials often exhibit lower breakdown strength when ...
Usage of cable systems has increased during the last decades both for AC and DC solutions. To make t...
Interfaces between solid dielectric materials may exhibit lower breakdown strength compared to that ...