As technology scales down in order to meet demands of more computing power per area, a variety of challenges emerge. Devices with channel lengths of a few nano meters require atomic precision when they are manufactured. Small irregularities in the equipment and manufacturing environment can cause large process variations from die--to--die, but also within--die variations. Along with the increasing density of transistors per die which has led to severe performance issues due to temperature variations, these effects may seriously impact operation and cause large deviations in frequency and power across a the chip. This thesis will present the analysis and design of a circuit with the goal of compensating the threshold voltage, by means of bo...
The driving force for the semiconductor industry growth has been the elegant scaling nature of CMOS ...
none5siAdvanced Ultra-Low Power (ULP) computing platforms can be affected by large performance varia...
Temperature and process variations have become key issues in the design of integrated circuits using...
As technology scales down in order to meet demands of more computing power per area, a variety of ch...
As technology scales down in order to meet demands of more computing power per area, a variety of ch...
textAs we scale down each process generation the degree of control we have on device parameters decr...
textAs we scale down each process generation the degree of control we have on device parameters decr...
The most critical concern in circuit is to achieve high level of performance with very tight power c...
The most critical concern in circuit is to achieve high level of performance with very tight power c...
Temperature fluctuations alter threshold voltage, carrier mobility, and saturation velocity of a MOS...
Temperature dependent propagation delay characteristics of CMOS circuits will experience a complete ...
27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Ha...
27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Ha...
Advanced Ultra-Low Power (ULP) computing platforms can be affected by large performance variations. ...
Advanced Ultra-Low Power (ULP) computing platforms can be affected by large performance variations. ...
The driving force for the semiconductor industry growth has been the elegant scaling nature of CMOS ...
none5siAdvanced Ultra-Low Power (ULP) computing platforms can be affected by large performance varia...
Temperature and process variations have become key issues in the design of integrated circuits using...
As technology scales down in order to meet demands of more computing power per area, a variety of ch...
As technology scales down in order to meet demands of more computing power per area, a variety of ch...
textAs we scale down each process generation the degree of control we have on device parameters decr...
textAs we scale down each process generation the degree of control we have on device parameters decr...
The most critical concern in circuit is to achieve high level of performance with very tight power c...
The most critical concern in circuit is to achieve high level of performance with very tight power c...
Temperature fluctuations alter threshold voltage, carrier mobility, and saturation velocity of a MOS...
Temperature dependent propagation delay characteristics of CMOS circuits will experience a complete ...
27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Ha...
27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Ha...
Advanced Ultra-Low Power (ULP) computing platforms can be affected by large performance variations. ...
Advanced Ultra-Low Power (ULP) computing platforms can be affected by large performance variations. ...
The driving force for the semiconductor industry growth has been the elegant scaling nature of CMOS ...
none5siAdvanced Ultra-Low Power (ULP) computing platforms can be affected by large performance varia...
Temperature and process variations have become key issues in the design of integrated circuits using...