Wetting of metal surfaces plays an important role in fuel cells, corrosion science, and heat-transfer devices. It has been recently stipulated that Cu surface is hydrophobic. In order to address this issue we use high purity (1 1 1) Cu prepared without oxygen, and resistant to oxidation. Using the modern Fringe Projection Phase-Shifting method of surface roughness determination, together with a new cell allowing the vacuum and thermal desorption of samples, we define the relation between the copper surface roughness and water contact angle (WCA). Next by a simple extrapolation, we determine the WCA for the perfectly smooth copper surface (WCA = 34°). Additionally, the kinetics of airborne hydrocarbons adsorption on copper was measured. It i...
A comparative study of oxidation methods to create Cu surfaces with controlled wettability is report...
A comparative study of oxidation methods to create Cu surfaces with controlled wettability is report...
In this study, different forms of copper films were electrodeposited (ED) on silicon wafer, copper ...
A hierarchical copper structure combining micro- and nanogaps/pores was built up on copper substrate...
A hierarchical copper structure combining micro- and nanogaps/pores was built up on copper substrate...
Tuning of the wetting behavior of metallic surfaces by chemical and topographical modification has b...
Modification of surfaces to enable dropwise condensation is a promising approach for achieving high ...
Ultra hydrophobic (or super hydrophobic) surfaces are known to be incredibly difficult to wet; this ...
Ultra hydrophobic (or super hydrophobic) surfaces are known to be incredibly difficult to wet; this ...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
The dropwise condensation is obtained on a copper surface by modifying the texture of the bare surfa...
Hydrophobic surfaces and coatings have attracted more and more interest in recent years due to their...
Hydrophobic surfaces and coatings have attracted more and more interest in recent years due to their...
Hydrophobic surfaces and coatings have attracted more and more interest in recent years due to their...
The spread of bacterial infections often occurs through indirect contact with infected individuals. ...
A comparative study of oxidation methods to create Cu surfaces with controlled wettability is report...
A comparative study of oxidation methods to create Cu surfaces with controlled wettability is report...
In this study, different forms of copper films were electrodeposited (ED) on silicon wafer, copper ...
A hierarchical copper structure combining micro- and nanogaps/pores was built up on copper substrate...
A hierarchical copper structure combining micro- and nanogaps/pores was built up on copper substrate...
Tuning of the wetting behavior of metallic surfaces by chemical and topographical modification has b...
Modification of surfaces to enable dropwise condensation is a promising approach for achieving high ...
Ultra hydrophobic (or super hydrophobic) surfaces are known to be incredibly difficult to wet; this ...
Ultra hydrophobic (or super hydrophobic) surfaces are known to be incredibly difficult to wet; this ...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
The dropwise condensation is obtained on a copper surface by modifying the texture of the bare surfa...
Hydrophobic surfaces and coatings have attracted more and more interest in recent years due to their...
Hydrophobic surfaces and coatings have attracted more and more interest in recent years due to their...
Hydrophobic surfaces and coatings have attracted more and more interest in recent years due to their...
The spread of bacterial infections often occurs through indirect contact with infected individuals. ...
A comparative study of oxidation methods to create Cu surfaces with controlled wettability is report...
A comparative study of oxidation methods to create Cu surfaces with controlled wettability is report...
In this study, different forms of copper films were electrodeposited (ED) on silicon wafer, copper ...