Optimization of ohmic contact for AlGaN/GaN HEMT on low-resistivity silicon

In this article, we report the optimization of ohmic contact formation on AlGaN/GaN on low-resistivity silicon. For achieving this, a strategy of uneven AlGaN/GaN was introduced through patterned etching of the substrate under the contact. Various pattern designs (holes, horizontal lines, vertical lines, grid) and varied etch depth (above and below the 2-D electron gas) were investigated. Furthermore, a study of planar and nonplanar ohmic metallization was investigated. Compared to a traditional fabrication strategy, we observed a reduced contact resistance from 0.35 to 0.27 Ω · mm by employing a grid etching approach with a “below channel” etch depth and nonplanar ohmic metallization. In general, measurements of “below channel” test structures exhibited improved contact resistance compared to “above channel” in both planar and nonplanar ohmic metallization