In order to meet the ever more demanding requirements of modern thermal management with the increasing high power density, an easy-fabricated laminated graphene film/indium/aluminum (GF/In/Al) composite was developed. The GF was fabricated through assemble graphene oxide (GO) sheets in a layer-by-layer structure and then subjected to graphitization process at high temperature as well as press forming process. The fabricated GF exhibits ultrahigh in-plane thermal conductivity together with good tensile strength. The GF/In/Al laminated composite was fabricated by hot-pressing indium coated GF and Al layers in vacuum environment. The indium layer was easily coated onto the GF due to its low melting point along with good flowing property. The t...
As the portable device hardware has been increasing at a noticeable rate, ultrathin thermal conducti...
We developed high-performance thermal interface materials (TIMs) based on a few-layer graphene (FLG)...
Urged by the increasing power and packing densities of integrated circuits and electronic devices, e...
A light-weight, robust and highly thermal conductive copper/graphene film laminated structure was de...
Heat dissipation has become one of the critical challenges of development for microelectronic produc...
High density packaging in combination with increased transistor integration inevitably leads to chal...
In this paper, a graphene enhanced thermal conductive adhesive (G-TCA) was developed for thermal man...
Metal laminated composites are widely used in industrial and commercial applications due to their ex...
With the recent upsurge in electronic and telecommunications industries, there is an extensive deman...
According to Moore\u27s Laws, complexity and power densities of electronic devices are increased dur...
High density packaging in combination with increased transistor integration inevitably leads to chal...
Graphene-based heat spreading materials, including graphene-based film (GBF) and graphene-based elec...
Thermal management materials (TMMs) used in electronic devices are crucial for future electronics an...
Large-area bulk oxidized cellulose nanocrystal (OCNC)/graphene nanocomposites with highly oriented s...
In this study, an innovative thermal interface material (TIM) paper based on a composite of cellulos...
As the portable device hardware has been increasing at a noticeable rate, ultrathin thermal conducti...
We developed high-performance thermal interface materials (TIMs) based on a few-layer graphene (FLG)...
Urged by the increasing power and packing densities of integrated circuits and electronic devices, e...
A light-weight, robust and highly thermal conductive copper/graphene film laminated structure was de...
Heat dissipation has become one of the critical challenges of development for microelectronic produc...
High density packaging in combination with increased transistor integration inevitably leads to chal...
In this paper, a graphene enhanced thermal conductive adhesive (G-TCA) was developed for thermal man...
Metal laminated composites are widely used in industrial and commercial applications due to their ex...
With the recent upsurge in electronic and telecommunications industries, there is an extensive deman...
According to Moore\u27s Laws, complexity and power densities of electronic devices are increased dur...
High density packaging in combination with increased transistor integration inevitably leads to chal...
Graphene-based heat spreading materials, including graphene-based film (GBF) and graphene-based elec...
Thermal management materials (TMMs) used in electronic devices are crucial for future electronics an...
Large-area bulk oxidized cellulose nanocrystal (OCNC)/graphene nanocomposites with highly oriented s...
In this study, an innovative thermal interface material (TIM) paper based on a composite of cellulos...
As the portable device hardware has been increasing at a noticeable rate, ultrathin thermal conducti...
We developed high-performance thermal interface materials (TIMs) based on a few-layer graphene (FLG)...
Urged by the increasing power and packing densities of integrated circuits and electronic devices, e...