The objective of this thesis is to develop circuit-aware interconnect technology optimization for network-on-chip based many-core architectures. The dimensions of global interconnects in many-core chips are optimized for maximum bandwidth density and minimum delay taking into account network-on-chip router latency and size effects of copper. The optimal dimensions thus obtained are used to characterize different network-on-chip topologies based on wiring area utilization, maximum core-to-core channel width, aggregate chip bandwidth and worse case latency. Finally, the advantages of many-core many-tier chips are evaluated for different network-on-chip topologies. Area occupied by a router within a core is shown to be the bottleneck t...
In recent years, modern graphics processing units have been widely adopted in high performance compu...
This work presents the design and implementation of CMOS LC voltage controlled oscillators. On-chip ...
With the coming of age of the Internet of Things (IoT), demand on ultra-low power (ULP) and low-cost...
Presented in this work is a novel design technique for a low-phase-noise high-frequency CMOS voltage...
All-Optical Networks employing Dense Wavelength Division Multiplexing (DWDM) are believed to be the ...
Conventional approaches to asset monitoring involve high-priced sensors paired with a dedicated radi...
The objective of this research is to present a low power modem technology for a high speed millimete...
Solder joint is the major part of electronic devices to form an electrical connection and mechanical...
Dramatic advances are taking place in the microelectronic industry. The feature size continues to s...
Current electrical systems are faced with the limitation in performance by the electrical interconne...
Various compact and packaging-adaptive antennas have been designed for practical wireless communicat...
The objective of the research is to develop a cost-effective high-power bi-directional dc/dc convert...
Sustaining high performance demand has led to the development of manycore processors. These manycore...
The exponentially growing design complexity with technological advancement calls for a large scope i...
An interconnected dc grid that comprises resistive and constant-power loads (CPLs) that is fed by Ph...
In recent years, modern graphics processing units have been widely adopted in high performance compu...
This work presents the design and implementation of CMOS LC voltage controlled oscillators. On-chip ...
With the coming of age of the Internet of Things (IoT), demand on ultra-low power (ULP) and low-cost...
Presented in this work is a novel design technique for a low-phase-noise high-frequency CMOS voltage...
All-Optical Networks employing Dense Wavelength Division Multiplexing (DWDM) are believed to be the ...
Conventional approaches to asset monitoring involve high-priced sensors paired with a dedicated radi...
The objective of this research is to present a low power modem technology for a high speed millimete...
Solder joint is the major part of electronic devices to form an electrical connection and mechanical...
Dramatic advances are taking place in the microelectronic industry. The feature size continues to s...
Current electrical systems are faced with the limitation in performance by the electrical interconne...
Various compact and packaging-adaptive antennas have been designed for practical wireless communicat...
The objective of the research is to develop a cost-effective high-power bi-directional dc/dc convert...
Sustaining high performance demand has led to the development of manycore processors. These manycore...
The exponentially growing design complexity with technological advancement calls for a large scope i...
An interconnected dc grid that comprises resistive and constant-power loads (CPLs) that is fed by Ph...
In recent years, modern graphics processing units have been widely adopted in high performance compu...
This work presents the design and implementation of CMOS LC voltage controlled oscillators. On-chip ...
With the coming of age of the Internet of Things (IoT), demand on ultra-low power (ULP) and low-cost...