Add to ORKG3D design is being recognized widely as the next BIG thing in system integration. However, design and analysis tools for 3D are still in infancy stage. Power supply noise analysis is one of the critical aspects of a design. Hence, the area of noise analysis for 3D designs is a key area for future development. The following research presents a new parasitic RLC modeling technique for 3D chips containing TSVs as well as a novel optimization algorithm for power-ground network of a 3D chip with the aim of minimizing noise in the network. The following work also looks into an existing commercial IR drop analysis tool and presents a way to modify it with the aim of handling 3D designs containing TSVs.M.S.Committee Chair: Lim, Sung-Kyu; Committee ...
Abstract—In recent years, interconnect issues emerged as major performance challenges for Two-Dimens...
Thesis (Ph. D.)--University of Rochester. Dept. of Electrical and Computer Engineering, 2013Through ...
Three-dimensional integrated circuits (3-D IC) are available through the die-stacking and through-si...
Abstract—With the extensive research on through-silicon-via (TSV) and die-stacking technology from b...
As one of more-than-Moore technologies, 3D ICs enable next-generation systems with much higher devic...
Abstract—3-D integration has the potential to increase perfor-mance and decrease energy consumption....
Three-dimensional (3D) integrated circuit (IC) technology has been proposed and used to reduce the d...
Three dimensional (3D) integrated circuit (IC) technology has been proposed and used to reduce the d...
Abstract—To harness the full potential of 3-D integrated circuits, analysis tools for early design s...
To reduce interconnect delay and power consumption while improving chip performance, a three-dimensi...
Reducing the interconnect size with each technology node and increasing speed with each generation i...
Abstract-In this paper, we study the signal integrity issues of throughsilicon-via (TSV)-based 3D IC...
A physical model for the design of the power distribution networks in three-dimensional integrated c...
To improve performances of integrated circuits and decrease the technology cost, designers follow “M...
To improve performances of integrated circuits and decrease the technology cost, designers follow “M...
Abstract—In recent years, interconnect issues emerged as major performance challenges for Two-Dimens...
Thesis (Ph. D.)--University of Rochester. Dept. of Electrical and Computer Engineering, 2013Through ...
Three-dimensional integrated circuits (3-D IC) are available through the die-stacking and through-si...
Abstract—With the extensive research on through-silicon-via (TSV) and die-stacking technology from b...
As one of more-than-Moore technologies, 3D ICs enable next-generation systems with much higher devic...
Abstract—3-D integration has the potential to increase perfor-mance and decrease energy consumption....
Three-dimensional (3D) integrated circuit (IC) technology has been proposed and used to reduce the d...
Three dimensional (3D) integrated circuit (IC) technology has been proposed and used to reduce the d...
Abstract—To harness the full potential of 3-D integrated circuits, analysis tools for early design s...
To reduce interconnect delay and power consumption while improving chip performance, a three-dimensi...
Reducing the interconnect size with each technology node and increasing speed with each generation i...
Abstract-In this paper, we study the signal integrity issues of throughsilicon-via (TSV)-based 3D IC...
A physical model for the design of the power distribution networks in three-dimensional integrated c...
To improve performances of integrated circuits and decrease the technology cost, designers follow “M...
To improve performances of integrated circuits and decrease the technology cost, designers follow “M...
Abstract—In recent years, interconnect issues emerged as major performance challenges for Two-Dimens...
Thesis (Ph. D.)--University of Rochester. Dept. of Electrical and Computer Engineering, 2013Through ...
Three-dimensional integrated circuits (3-D IC) are available through the die-stacking and through-si...