© 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.DOI: 10....
This paper deals with electrically conductive adhesives (ECA's) with isotropic properties (ICA's) an...
Isotropically conductive adhesives (ICAs) are promising as a lead-free interconnect material; Howeve...
There has been a steadily increasing interest in using electrically conductive adhesives as intercon...
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over ...
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over ...
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over ...
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over ...
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over ...
This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reade...
©2006 IEEE. Personal use of this material is permitted. However, permission to reprint/republish thi...
The goal of the work has been to check a possibility of improvement of electrical properties of elec...
Microelectronic packaging has been accelerating towards adoption of novel solutions that offer lower...
Microelectronic packaging has been accelerating towards adoption of novel solutions that offer lower...
This paper explores both experimentally and through analytical and computational models, the mechani...
Isotropically conductive adhesives (ICAs) are promising as a lead-free interconnect material; Howeve...
This paper deals with electrically conductive adhesives (ECA's) with isotropic properties (ICA's) an...
Isotropically conductive adhesives (ICAs) are promising as a lead-free interconnect material; Howeve...
There has been a steadily increasing interest in using electrically conductive adhesives as intercon...
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over ...
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over ...
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over ...
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over ...
Anisotropic Conductive Adhesives (ACAs) have been used in fine pitch electronics packaging for over ...
This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reade...
©2006 IEEE. Personal use of this material is permitted. However, permission to reprint/republish thi...
The goal of the work has been to check a possibility of improvement of electrical properties of elec...
Microelectronic packaging has been accelerating towards adoption of novel solutions that offer lower...
Microelectronic packaging has been accelerating towards adoption of novel solutions that offer lower...
This paper explores both experimentally and through analytical and computational models, the mechani...
Isotropically conductive adhesives (ICAs) are promising as a lead-free interconnect material; Howeve...
This paper deals with electrically conductive adhesives (ECA's) with isotropic properties (ICA's) an...
Isotropically conductive adhesives (ICAs) are promising as a lead-free interconnect material; Howeve...
There has been a steadily increasing interest in using electrically conductive adhesives as intercon...