The Effect of Residual Stress on the Fatigue Crack Growth Behavior of Al-Si-Mg Cast Alloys - Mechanisms and Corrective Mathematical Models

The fatigue crack growth (FCG) behavior of various types of alloys is significantly affected by the presence of residual stress induced by manufacturing and post-manufacturing processes. There is a qualitative understanding of the effects of residual stress on fatigue behavior, but the effects are not comprehensively quantified or accounted for. The difficulty in quantifying these effects is largely due to the complexity of residual-stress measurements (especially considering that parts produced in similar conditions can have different residual-stress levels) and the lack of mathematical models able to convert experimental data with residual stress into residual-stress-free data. This article provides experimental, testing, and mathematical techniques to account for residual-stress effects on crack growth rate data, together with two methods for eliminating residual stresses in crack growth test specimens. Fracture- mechanics concepts are used to calculate, in simple and convenient ways, stress-intensity factors caused by residual stresses. The method is advantageous, considering that stress-intensity factors are determined before the actual test is conducted. Further on, residual-stress-intensity factors are used to predict the residual-stress distribution in compact tension (CT) specimens prior to testing. Five cast Al-Si-Mg alloys with three Si levels (in unmodified (UM) as well as Sr-modified (M) conditions) were analyzed both with and without residual stress. Fatigue cracks are grown under both constant stress ratio. R = 0.1, and constant maximum stress-intensity factor, K-max = const., conditions. The mechanisms involved in crack growth through residual-stress fields are presented