International audienceA systematic study of the variations of the contrast of a dislocation in silicon on section topographs with thedepth of the line was performed both experimentally and with computer simulations. Mo Kalpha1 radiationand 33-3 and -3-33 symmetric reflections were used. The crystal thickness was 440 microns so that the value of mu*twas 0.64. The influence of the orientation of the dislocation was studied for values of the angle betweenthe line and its Burgers vector ranging between 60 and 90 ° in the glide plane. It was observed that when thedislocation lies close to the entrance surface, whatever its orientation, its image is centred around the traceof the plane of incidence passing through the intersection of the dislocat...
In the semiconductor industry, wafer handling introduces micro-cracks at the wafer edge and the caus...
Experimental problems in the application of the Berg-Barrett Method to the observation of dislocatio...
In the semiconductor industry, wafer handling introduces micro-cracks at the wafer edge and the caus...
This thesis describes the application of the well established technique of X-ray diffraction topogra...
X-ray reflection topographs were taken of a zinc surface oriented about 1° from a basal plane. Basal...
X-ray reflection topographs were taken of a zinc surface oriented about 1° from a basal plane. Basal...
When performing transmission polychromatic beam topography, the extensions to the line segments of t...
A stereo pair of Berg-Barrett topographs of an (0001) surface of zinc is obtained with a single expo...
On a étudié, par la méthode de topographie aux rayons X de Borrmann, les dislocations dans des crist...
On a étudié, par la méthode de topographie aux rayons X de Borrmann, les dislocations dans des crist...
Bragg-case synchrotron section topographs were studied in parallel slabs cut from a synthetic diamon...
Crystals growing from solution, the vapour phase and from supercooled melt exhibit, as a rule, plana...
The methods of X-ray diffraction topography are reviewed : the reflection, Berg-Barrett method, and ...
The influence of the number of diffracted beams on weak-beam contrast simulations of thickness conto...
International audienceLong dislocations with Burgers vectors along are unusual in f.c.c. lattices. ...
In the semiconductor industry, wafer handling introduces micro-cracks at the wafer edge and the caus...
Experimental problems in the application of the Berg-Barrett Method to the observation of dislocatio...
In the semiconductor industry, wafer handling introduces micro-cracks at the wafer edge and the caus...
This thesis describes the application of the well established technique of X-ray diffraction topogra...
X-ray reflection topographs were taken of a zinc surface oriented about 1° from a basal plane. Basal...
X-ray reflection topographs were taken of a zinc surface oriented about 1° from a basal plane. Basal...
When performing transmission polychromatic beam topography, the extensions to the line segments of t...
A stereo pair of Berg-Barrett topographs of an (0001) surface of zinc is obtained with a single expo...
On a étudié, par la méthode de topographie aux rayons X de Borrmann, les dislocations dans des crist...
On a étudié, par la méthode de topographie aux rayons X de Borrmann, les dislocations dans des crist...
Bragg-case synchrotron section topographs were studied in parallel slabs cut from a synthetic diamon...
Crystals growing from solution, the vapour phase and from supercooled melt exhibit, as a rule, plana...
The methods of X-ray diffraction topography are reviewed : the reflection, Berg-Barrett method, and ...
The influence of the number of diffracted beams on weak-beam contrast simulations of thickness conto...
International audienceLong dislocations with Burgers vectors along are unusual in f.c.c. lattices. ...
In the semiconductor industry, wafer handling introduces micro-cracks at the wafer edge and the caus...
Experimental problems in the application of the Berg-Barrett Method to the observation of dislocatio...
In the semiconductor industry, wafer handling introduces micro-cracks at the wafer edge and the caus...