Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with the aim of providing circuits with reliable and constant operating voltage. This network has non-neglible electrical parasitics. Consequently, when digital circuits inside the chip switch, the supply voltage delivered to them does not remain ideal and exhibits spatial and temporal voltage fluctuations. These fluctuations in the supply voltage, known as the power-supply noise (PSN), can affect the functionality and the performance of modern microprocessors. The design of this PDN in the chip is an important part in ensuring power integrity. Modeling and simulation of the PSN in on-chip PDNs is important to reduce the cost of processors. These ...
Designing a chip to obtain maximum performance and maintaining decent voltage levels with low power ...
Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integrati...
Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integrati...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
The pursuit for higher performance at a lower cost is driving rapid progress in the field of package...
The pursuit for higher performance at a lower cost is driving rapid progress in the field of package...
This thesis focused on modeling and simulation of simultaneous switching noise in packages as well a...
High-speed digital systems are moving to higher data rates and smaller supply voltages as the scale ...
This thesis focused on modeling and simulation of simultaneous switching noise in packages as well a...
As semiconductor devices become more densely integrated on a single chip, complexity of packaging ha...
In the first article of this thesis, the charge delivery in the power distribution network for print...
As the Moore’s Law continues to drive IC technology, power delivery has become one of the most diffi...
As the semiconductor process nodes advance to 28nm and below and three-dimensional (3D) silicon inte...
As the semiconductor process nodes advance to 28nm and below and three-dimensional (3D) silicon inte...
Power networks supply power from the P/G pads on a chip to the circuit modules. With the rapid incre...
Designing a chip to obtain maximum performance and maintaining decent voltage levels with low power ...
Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integrati...
Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integrati...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
The pursuit for higher performance at a lower cost is driving rapid progress in the field of package...
The pursuit for higher performance at a lower cost is driving rapid progress in the field of package...
This thesis focused on modeling and simulation of simultaneous switching noise in packages as well a...
High-speed digital systems are moving to higher data rates and smaller supply voltages as the scale ...
This thesis focused on modeling and simulation of simultaneous switching noise in packages as well a...
As semiconductor devices become more densely integrated on a single chip, complexity of packaging ha...
In the first article of this thesis, the charge delivery in the power distribution network for print...
As the Moore’s Law continues to drive IC technology, power delivery has become one of the most diffi...
As the semiconductor process nodes advance to 28nm and below and three-dimensional (3D) silicon inte...
As the semiconductor process nodes advance to 28nm and below and three-dimensional (3D) silicon inte...
Power networks supply power from the P/G pads on a chip to the circuit modules. With the rapid incre...
Designing a chip to obtain maximum performance and maintaining decent voltage levels with low power ...
Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integrati...
Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integrati...