Electronic components have large geometric scale factors, and involve materials with very different thermal conductivities. Experience shows that in this context, the boundary element method is a good choice for thermal simulation in steady state. In transient regime, the temporal dimension adds a number of difficulties. Among these are typically higher computation time and stability criteria, or more generally the links between spatial and temporal discretizations. More specifically, a current issue in electronics is to measure the impact of highly localized phenomena, such as switching or short circuit on the overall thermal component. This is then coupled space-time scales, ensuring in particular the changes of scale without loss of info...
This paper is devoted to investigate the temporal and spatial accuracy in transient conjugate heat t...
In this paper we present the spatial discretization of the thermal element model for coupled electro...
Currently, almost all material manufacturing processes are simulatedusing methods based on continuum...
Electronic components have large geometric scale factors, and involve materials with very different ...
A new algorithm for coupling boundary and finite element methods is developed for transient two dime...
International audienceDescription of complex materials involves numerous computational challenges. T...
Description of complex materials involves numerous computational challenges. Thus, the analysis of t...
La densification extrême des cartes électroniques, couplée à une compacité toujours plus accrue entr...
In this paper we present the spatial discretization of the thermal element model for coupled electro...
This paper investigates the heat equation for domains subjected to an internal source with a sharp s...
International audienceThis paper presents a computationally efficient homogenization method for tran...
This paper develops a parallel domain decomposition Laplace transform BEM algorithm for the solution...
This paper develops a parallel domain decomposition Laplace transform BEM algorithm for the solution...
In this paper, we develop a parallel domain decomposition Laplace transform BEM algorithm for the so...
A method, using boundary elements, is presented as a solution to plane transient heat conduction. Th...
This paper is devoted to investigate the temporal and spatial accuracy in transient conjugate heat t...
In this paper we present the spatial discretization of the thermal element model for coupled electro...
Currently, almost all material manufacturing processes are simulatedusing methods based on continuum...
Electronic components have large geometric scale factors, and involve materials with very different ...
A new algorithm for coupling boundary and finite element methods is developed for transient two dime...
International audienceDescription of complex materials involves numerous computational challenges. T...
Description of complex materials involves numerous computational challenges. Thus, the analysis of t...
La densification extrême des cartes électroniques, couplée à une compacité toujours plus accrue entr...
In this paper we present the spatial discretization of the thermal element model for coupled electro...
This paper investigates the heat equation for domains subjected to an internal source with a sharp s...
International audienceThis paper presents a computationally efficient homogenization method for tran...
This paper develops a parallel domain decomposition Laplace transform BEM algorithm for the solution...
This paper develops a parallel domain decomposition Laplace transform BEM algorithm for the solution...
In this paper, we develop a parallel domain decomposition Laplace transform BEM algorithm for the so...
A method, using boundary elements, is presented as a solution to plane transient heat conduction. Th...
This paper is devoted to investigate the temporal and spatial accuracy in transient conjugate heat t...
In this paper we present the spatial discretization of the thermal element model for coupled electro...
Currently, almost all material manufacturing processes are simulatedusing methods based on continuum...