Development of New Low Stress Epoxies for MEMS Device Encapsulation

©2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.In this study, a series of new low stress epoxies was introduced as conformal encapsulants, which show a high promise to meet all the requirements for the protection of the pressure sensor system. Mechanical properties such as initial Young’s modulus, toughness and ultimate tensile stress were evaluated. The more critical issue of material’s contamination resistance to the jet fuel was improved. And the mechanism behind materials lowstress and toughness behaviors was investigated from the viewpoint of microstructure