The European Space Agency and CNES are studying the possibility of sending microsystems in space, especially for the mass gain they represent. To improve the reliability of components, it is necessary to know their mechanical properties. Several characterization techniques exist, especially nanoindentation of thin films on substrates. However, results can be largely influenced by the substrate in the case of micron layers. The methods of uniaxial tension (CNES) and bulge-test (INL) on freestanding specimen are used to eliminate the effects of the substrate, but the fabrication of such structures is complex and requires many technological steps to remove the substrate on the backside. The objective of this thesis is to understand the relati...
La fabrication des dispositifs en microélectronique implique aujourd’hui une architecture tridimensi...
Thin films are complex systems exhibiting remarkable mechanical properties compared to their bulk co...
Fabriquer des dispositifs microélectroniques en utilisant des technologies d'intégration 3D nécessit...
L'agence spatiale européenne et le CNES étudient la possibilité d’envoyer des microsystèmes dans l’e...
The development of micro- and nano- technologies is strongly correlated with the knowledge of the me...
Les couches minces sont utilisées dans un nombre important de domaines industriels comme les Micro- ...
The thin films are used in a large number of industrial fields such as Micro- and Nano- Technology (...
The paper compares two different methods for testing of metallic thin films: microcompression test a...
Abstract Mechanical properties of an aluminium thin film were measured by microcompression and inden...
Un nouvel essai mécanique a été développé pour répondre à la demande d'analyse des propriétés mécani...
Three different tests, developed on a nanoindentation apparatus, are used for the mechanical charact...
A new mechanical testing device of free standing membranes by Bulge Test has been built at Institute...
The purpose of this study was to determine the influence of different substrates (C45 steel, polycar...
Industrial application of materials at the micrometer and submicrometer scales requires accurate mec...
Les films minces métalliques sont couramment utilisés en électronique, et les phénomènes plastiques ...
La fabrication des dispositifs en microélectronique implique aujourd’hui une architecture tridimensi...
Thin films are complex systems exhibiting remarkable mechanical properties compared to their bulk co...
Fabriquer des dispositifs microélectroniques en utilisant des technologies d'intégration 3D nécessit...
L'agence spatiale européenne et le CNES étudient la possibilité d’envoyer des microsystèmes dans l’e...
The development of micro- and nano- technologies is strongly correlated with the knowledge of the me...
Les couches minces sont utilisées dans un nombre important de domaines industriels comme les Micro- ...
The thin films are used in a large number of industrial fields such as Micro- and Nano- Technology (...
The paper compares two different methods for testing of metallic thin films: microcompression test a...
Abstract Mechanical properties of an aluminium thin film were measured by microcompression and inden...
Un nouvel essai mécanique a été développé pour répondre à la demande d'analyse des propriétés mécani...
Three different tests, developed on a nanoindentation apparatus, are used for the mechanical charact...
A new mechanical testing device of free standing membranes by Bulge Test has been built at Institute...
The purpose of this study was to determine the influence of different substrates (C45 steel, polycar...
Industrial application of materials at the micrometer and submicrometer scales requires accurate mec...
Les films minces métalliques sont couramment utilisés en électronique, et les phénomènes plastiques ...
La fabrication des dispositifs en microélectronique implique aujourd’hui une architecture tridimensi...
Thin films are complex systems exhibiting remarkable mechanical properties compared to their bulk co...
Fabriquer des dispositifs microélectroniques en utilisant des technologies d'intégration 3D nécessit...