The pursuit for higher performance at a lower cost is driving rapid progress in the field of packaged digital systems. As the complexity of interconnects and packages increases, and the rise and fall time of the signal decreases, the electromagnetic effects in distributed passive structures become an important factor in determining the system performance. Hence there is a need to accurately simulate these parasitic electromagnetic effects that are observed in the signal distribution network (SDN) and the power delivery network (PDN) of an electronic system. The accurate simulation of high-speed systems requires information on the high frequency transient currents that are injected into the power distribution network causing simultaneous sw...
In the first article of this thesis, the charge delivery in the power distribution network for print...
Simultaneous switching noise (SSN) resulting from IC devices can result in significant power bus noi...
Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integrati...
The pursuit for higher performance at a lower cost is driving rapid progress in the field of package...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
This thesis focused on modeling and simulation of simultaneous switching noise in packages as well a...
When the performances of the electronic technology increase (higher frequencies, more power, lover p...
This thesis focused on modeling and simulation of simultaneous switching noise in packages as well a...
As layout density increases in highly integrated multilayer printed circuit boards (PCBs), the noise...
High-speed digital systems are moving to higher data rates and smaller supply voltages as the scale ...
This thesis, performed in NXP Semiconductors, presents an analysis on POWER INTEGRITY and SIGNAL INT...
At present, the performance of most high speed digital systems is not limited by the speed of the sw...
At present, the performance of most high speed digital systems is not limited by the speed of the sw...
This dissertation is composed of three papers, which cover the prediction of the characteristics of ...
In the first article of this thesis, the charge delivery in the power distribution network for print...
Simultaneous switching noise (SSN) resulting from IC devices can result in significant power bus noi...
Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integrati...
The pursuit for higher performance at a lower cost is driving rapid progress in the field of package...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
Power distribution networks (PDNs) are conducting structures employed in semiconductor systems with ...
This thesis focused on modeling and simulation of simultaneous switching noise in packages as well a...
When the performances of the electronic technology increase (higher frequencies, more power, lover p...
This thesis focused on modeling and simulation of simultaneous switching noise in packages as well a...
As layout density increases in highly integrated multilayer printed circuit boards (PCBs), the noise...
High-speed digital systems are moving to higher data rates and smaller supply voltages as the scale ...
This thesis, performed in NXP Semiconductors, presents an analysis on POWER INTEGRITY and SIGNAL INT...
At present, the performance of most high speed digital systems is not limited by the speed of the sw...
At present, the performance of most high speed digital systems is not limited by the speed of the sw...
This dissertation is composed of three papers, which cover the prediction of the characteristics of ...
In the first article of this thesis, the charge delivery in the power distribution network for print...
Simultaneous switching noise (SSN) resulting from IC devices can result in significant power bus noi...
Mixed signal system-on-package (SoP) technology is a key enabler for increasing functional integrati...