The multilayer materials processed by powder metallurgy allow reducing the manufacturing cost. However, the multilayers assembly often leads to cracks or even debonding, which decreases the piece properties.The main purpose of this work is to better understand which important parameters have to be taken into account and their influences on the multimaterials processing. In order to fulfil this objective, the cosintering of three different couples of bimaterials in thick layer has been studied. To identify the damaging reasons in the bilayers, an in situ monitoring device has been developed to observe deformations, cracks and debonding. Moreover, the cosintering simulation with a Binghamien law model was performed to evaluate the internal st...
The fabrication of devices in microelectronics today involves a three-dimensional architecture: "3D ...
Le forgeage multi-matériaux est un procédé permettant la mise en forme et l’assemblage simultanés de...
International audienceAs multilayer materials are essential to today's industry, solid state co-sint...
L’élaboration de multimatériaux en couches par métallurgie des poudres permet de réduire les coûts d...
LTCC (Low Temperature Co-fired Ceramic) and gold multilayers systems are extensively used in the dev...
The processing of multifunctional multimaterials by powder metallurgy is useful to combine complemen...
Les travaux présentés dans ce manuscrit visent à étudier la propagation d'un défaut interfacial de g...
International audienceParts composed of two ceramic-metal composite layers have been fabricated by c...
The processing of multifunctional multimaterials by powder metallurgy is useful to combine complemen...
The multi-material forging is a forming process allowing, simultaneously, the welding and shaping of...
The present doctoral thesis summarises results of investigation focused on the characterisation of m...
The work focuses on potting materials for electronic components. A methodology to analyse the behavi...
The objective of this work is to establish the relationships between interface chemistry and mechani...
The fabrication of devices in microelectronics today involves a three-dimensional architecture: "3D ...
Le forgeage multi-matériaux est un procédé permettant la mise en forme et l’assemblage simultanés de...
International audienceAs multilayer materials are essential to today's industry, solid state co-sint...
L’élaboration de multimatériaux en couches par métallurgie des poudres permet de réduire les coûts d...
LTCC (Low Temperature Co-fired Ceramic) and gold multilayers systems are extensively used in the dev...
The processing of multifunctional multimaterials by powder metallurgy is useful to combine complemen...
Les travaux présentés dans ce manuscrit visent à étudier la propagation d'un défaut interfacial de g...
International audienceParts composed of two ceramic-metal composite layers have been fabricated by c...
The processing of multifunctional multimaterials by powder metallurgy is useful to combine complemen...
The multi-material forging is a forming process allowing, simultaneously, the welding and shaping of...
The present doctoral thesis summarises results of investigation focused on the characterisation of m...
The work focuses on potting materials for electronic components. A methodology to analyse the behavi...
The objective of this work is to establish the relationships between interface chemistry and mechani...
The fabrication of devices in microelectronics today involves a three-dimensional architecture: "3D ...
Le forgeage multi-matériaux est un procédé permettant la mise en forme et l’assemblage simultanés de...
International audienceAs multilayer materials are essential to today's industry, solid state co-sint...