Epoxy resins toughened with embedded thermoplastic particles are classically used in the aeronautical composites manufacturing. As matrix into laminated composites, epoxy resins determine the delamination resistance of the interlaminar field. The delamination process is a large decohesion that often occurs during impact loadings and it critically compromises the integrity of the light weight composite structures. However, most of the cohesive zone models are not intended to simulate delamination under high rate loadings. In particular, these models do not consider the expected effects of loading rate on fracture behaviour of the resin-rich interlaminar field. Therefore, this research aims at characterizing crack initiation and propagation i...
Mixed carbides (U, Pu)C, are good fuel candidate for IVth generation reactors because of their high ...
To obtain a relevant shape of a formed part during its finite element simulation, several steps are ...
The fabrication of microelectronic devices using 3D integration technologies requires a good knowled...
Epoxy resins toughened with embedded thermoplastic particles are classically used in the aeronautica...
The use of composite materials composed of polymeric matrix have known a growing interest in industr...
Thermal Barrier Coatings (TBCs) are used to protect turbine blades in the SNECMA-M88 aeroengine. A b...
Safety reassessments are periodically performed on the EDF nuclear power plants and the recent seism...
The high pressure turbine blade of aeroengine are submitted to severe thermomechanical loading in se...
Nowadays the use of superplasticizers admixtures becomes unavoidable for concrete. It allows enhanci...
Mixed carbides (U, Pu)C, are good fuel candidate for IVth generation reactors because of their high ...
Mixed carbides (U, Pu)C, are good fuel candidate for IVth generation reactors because of their high ...
The purpose of this thesis is to perform a coupled thermomechanical simulation of the failure of the...
Mixed carbides (U, Pu)C, are good fuel candidate for IVth generation reactors because of their high ...
Mixed carbides (U, Pu)C, are good fuel candidate for IVth generation reactors because of their high ...
The fabrication of microelectronic devices using 3D integration technologies requires a good knowled...
Mixed carbides (U, Pu)C, are good fuel candidate for IVth generation reactors because of their high ...
To obtain a relevant shape of a formed part during its finite element simulation, several steps are ...
The fabrication of microelectronic devices using 3D integration technologies requires a good knowled...
Epoxy resins toughened with embedded thermoplastic particles are classically used in the aeronautica...
The use of composite materials composed of polymeric matrix have known a growing interest in industr...
Thermal Barrier Coatings (TBCs) are used to protect turbine blades in the SNECMA-M88 aeroengine. A b...
Safety reassessments are periodically performed on the EDF nuclear power plants and the recent seism...
The high pressure turbine blade of aeroengine are submitted to severe thermomechanical loading in se...
Nowadays the use of superplasticizers admixtures becomes unavoidable for concrete. It allows enhanci...
Mixed carbides (U, Pu)C, are good fuel candidate for IVth generation reactors because of their high ...
Mixed carbides (U, Pu)C, are good fuel candidate for IVth generation reactors because of their high ...
The purpose of this thesis is to perform a coupled thermomechanical simulation of the failure of the...
Mixed carbides (U, Pu)C, are good fuel candidate for IVth generation reactors because of their high ...
Mixed carbides (U, Pu)C, are good fuel candidate for IVth generation reactors because of their high ...
The fabrication of microelectronic devices using 3D integration technologies requires a good knowled...
Mixed carbides (U, Pu)C, are good fuel candidate for IVth generation reactors because of their high ...
To obtain a relevant shape of a formed part during its finite element simulation, several steps are ...
The fabrication of microelectronic devices using 3D integration technologies requires a good knowled...