The objective of the present thesis is to investigate new laser architectures with low Relative Intensity Noise (RIN) using the Silicon Photonics integration platform. We intend to reach “class-A” dynamics, in which relaxation oscillations are eliminated. In this conditions, lasers with class-A dynamics exhibit shot-noise limited RIN over a wide frequency bandwidth, typically from 100 MHz to 20 GHz. Such behaviour can be obtained with high-Q laser cavities, i.e with long cavities or with ultra-low losses cavities. The silicon photonics platform is a good candidate for the desired dynamical behaviour as it makes possible the implementation of long cavities (ten’s of cm) based on low losses silicon waveguides (dB/cm). Three different approach...
These research works is within the context of an improved link budget telemetry data on space launch...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact an...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact an...
Great interest is devoted to electro-optic (EO) polymers since they allow the fabrication of optical...
Great interest is devoted to electro-optic (EO) polymers since they allow the fabrication of optical...
Haptic rendering systems, or textural recreated systems, are nowaday in constant expension and repre...
The microelectronic devices designed in the silicon technology field are intrinsically limited due t...
The microelectronic devices designed in the silicon technology field are intrinsically limited due t...
Haptic rendering systems, or textural recreated systems, are nowaday in constant expension and repre...
Haptic rendering systems, or textural recreated systems, are nowaday in constant expension and repre...
The recent use of Ultra Wide Band technology in telecommunication implies the study of appropriated ...
In the framework of light-atom interaction, laser diodes need specific optical performances: high po...
The mother-of-pearl found in the shell of certain mollusks is a fascinating material with remarkable...
In the framework of light-atom interaction, laser diodes need specific optical performances: high po...
These research works is within the context of an improved link budget telemetry data on space launch...
These research works is within the context of an improved link budget telemetry data on space launch...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact an...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact an...
Great interest is devoted to electro-optic (EO) polymers since they allow the fabrication of optical...
Great interest is devoted to electro-optic (EO) polymers since they allow the fabrication of optical...
Haptic rendering systems, or textural recreated systems, are nowaday in constant expension and repre...
The microelectronic devices designed in the silicon technology field are intrinsically limited due t...
The microelectronic devices designed in the silicon technology field are intrinsically limited due t...
Haptic rendering systems, or textural recreated systems, are nowaday in constant expension and repre...
Haptic rendering systems, or textural recreated systems, are nowaday in constant expension and repre...
The recent use of Ultra Wide Band technology in telecommunication implies the study of appropriated ...
In the framework of light-atom interaction, laser diodes need specific optical performances: high po...
The mother-of-pearl found in the shell of certain mollusks is a fascinating material with remarkable...
In the framework of light-atom interaction, laser diodes need specific optical performances: high po...
These research works is within the context of an improved link budget telemetry data on space launch...
These research works is within the context of an improved link budget telemetry data on space launch...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact an...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact an...