Secondary Ion Mass Spectroscopy measurements, conducted to calibrate the new edgeless pixel production for the High Luminosity upgrade of the LHC, are being compared with TCAD simulated doping profiles for n and p implanted wafers. On the same context, simulation and characterization of varied bias rail geometry structures is being presented in an attempt to understand and compensate for the efficiency drop issue under the biasing gird region. Through 3D profile and field simulation, the structures under investigation are being compared with experimental measurements
\begin{abstract} In order to address the problems caused by the harsh radiation environment during t...
International audienceThrough SiMS measurements, the evolution of the doping profile is been studied...
International audienceFuture high-energy physics experiments require highly segmented silicon sensor...
Innovative edgeless planar pixel sensors for the High Luminosity LHC upgrade are under production. T...
International audienceThe LHC accelerator complex will be upgraded between 2020-2022, to the High-Lu...
International audienceAbstract:This work addresses the study of active edge n-in-p planar sensors. A...
The continual reduction in size of semiconductor structures and depths of junctions is putting a gre...
Ion beam mechanisms present in plasma doping have been investigated by comparing SIMS measurements o...
[[abstract]]Ion implantation is a standart doping technique for semiconductor material. For shallow ...
SIMS (Secondary Ion Mass Spectroscopy) is extensively used in microelectronics in order to measure t...
In order to address the problems caused by the harsh radiation environment during the high luminosit...
The impact of etching-induced variations of the gate geometry on the electrical performance of MOSFE...
International audienceA practical, yet physically grounded, TCAD modeling approach to study the radi...
This paper describes a methodology of TCAD application in VLSI design and development. Simulation-ba...
International audienceHigh-energy physics experiments at the future CERN High Luminosity LHC (Large ...
\begin{abstract} In order to address the problems caused by the harsh radiation environment during t...
International audienceThrough SiMS measurements, the evolution of the doping profile is been studied...
International audienceFuture high-energy physics experiments require highly segmented silicon sensor...
Innovative edgeless planar pixel sensors for the High Luminosity LHC upgrade are under production. T...
International audienceThe LHC accelerator complex will be upgraded between 2020-2022, to the High-Lu...
International audienceAbstract:This work addresses the study of active edge n-in-p planar sensors. A...
The continual reduction in size of semiconductor structures and depths of junctions is putting a gre...
Ion beam mechanisms present in plasma doping have been investigated by comparing SIMS measurements o...
[[abstract]]Ion implantation is a standart doping technique for semiconductor material. For shallow ...
SIMS (Secondary Ion Mass Spectroscopy) is extensively used in microelectronics in order to measure t...
In order to address the problems caused by the harsh radiation environment during the high luminosit...
The impact of etching-induced variations of the gate geometry on the electrical performance of MOSFE...
International audienceA practical, yet physically grounded, TCAD modeling approach to study the radi...
This paper describes a methodology of TCAD application in VLSI design and development. Simulation-ba...
International audienceHigh-energy physics experiments at the future CERN High Luminosity LHC (Large ...
\begin{abstract} In order to address the problems caused by the harsh radiation environment during t...
International audienceThrough SiMS measurements, the evolution of the doping profile is been studied...
International audienceFuture high-energy physics experiments require highly segmented silicon sensor...