Silica and microscope slides that had been pretreated with a variety of wet chemical, ultrasonic and laser irradiation surface preparation methods were contaminated with alumina particles of around 3 µm. The samples were prepared and processed without delay so as to avoid capillary condensation in a high humidity environment and thus ensuring that the process is dry laser cleaning. They were then irradiated with a pulse of 248 nm radiation from a KrF excimer laser, over a range of fluences. The laser cleaning results show that, in this case, the surface preparation method appears to have little effect on the laser cleaning efficiency. They also demonstrate that the threshold fluence for particle removal of silica is approximately eight time...
A model for nanosecond dry laser cleaning that treats the substrate and particle expansion on a unif...
We report on experiments on the underlying physical mechanisms in the Dry- (DLC) and Steam Laser Cle...
Laser Cleaning (SLC) process. Using a frequency doubled, Q-switched Nd:YAG laser (FWHM=8 ns) we remo...
Laser cleaning of 5.0μm diameter silica spheres from silica surfaces was investigated. It was found ...
Laser cleaning of micron and sub-micron particles from various substrates such as silicon wafers and...
Submicrometer (0.1–1 μm) polystyrene and alumina particles were removed by single-shot nanosecond 24...
In earlier work we characterised single-pulse laser cleaning of medium-density (areal coverage 10–20...
The cleaning of silicon surfaces from submicron dust particles has been studied by means of the “Ste...
Sub-micrometer (0.1-1 μm) polystyrene and alumina particles were removed by single-shot pulsed laser...
A model for ns dry laser cleaning that treats the substrate and particle expansion on a unified basi...
International audienceWe report on experimental investigations on the role of humidity in the laser ...
© 2016 Published by Elsevier Inc.Hypothesis: Reducing particle contaminations on solid and delicate ...
The preparation of surfaces free of particle contamination is one of the crucial prerequisites for a...
Abstract { We have studied the removal of submicrometer particles from silicon wafers by the steam l...
A fluence advantage was achieved in dry/damp laser cleaning by reduction of the laser beam dimension...
A model for nanosecond dry laser cleaning that treats the substrate and particle expansion on a unif...
We report on experiments on the underlying physical mechanisms in the Dry- (DLC) and Steam Laser Cle...
Laser Cleaning (SLC) process. Using a frequency doubled, Q-switched Nd:YAG laser (FWHM=8 ns) we remo...
Laser cleaning of 5.0μm diameter silica spheres from silica surfaces was investigated. It was found ...
Laser cleaning of micron and sub-micron particles from various substrates such as silicon wafers and...
Submicrometer (0.1–1 μm) polystyrene and alumina particles were removed by single-shot nanosecond 24...
In earlier work we characterised single-pulse laser cleaning of medium-density (areal coverage 10–20...
The cleaning of silicon surfaces from submicron dust particles has been studied by means of the “Ste...
Sub-micrometer (0.1-1 μm) polystyrene and alumina particles were removed by single-shot pulsed laser...
A model for ns dry laser cleaning that treats the substrate and particle expansion on a unified basi...
International audienceWe report on experimental investigations on the role of humidity in the laser ...
© 2016 Published by Elsevier Inc.Hypothesis: Reducing particle contaminations on solid and delicate ...
The preparation of surfaces free of particle contamination is one of the crucial prerequisites for a...
Abstract { We have studied the removal of submicrometer particles from silicon wafers by the steam l...
A fluence advantage was achieved in dry/damp laser cleaning by reduction of the laser beam dimension...
A model for nanosecond dry laser cleaning that treats the substrate and particle expansion on a unif...
We report on experiments on the underlying physical mechanisms in the Dry- (DLC) and Steam Laser Cle...
Laser Cleaning (SLC) process. Using a frequency doubled, Q-switched Nd:YAG laser (FWHM=8 ns) we remo...