A pulsed I-V thermal resistance Rth measurement method is formulated and applied on-wafer to a GaAs MMIC pHEMT. An investigation of device dispersion phenomena assesses their impact on the measurement. It is found that performing the Rth measurement using two quiescent bias points in close proximity (situated beyond the knee voltage yet prior to drain voltages that result in significant levels of gate leakage due to impact ionization) improves the accuracy of the method. Extraction of thermal coefficients characterizes the drain current reduction due to heating, allowing for an efficient calculation of Rth with improved precision.6 page(s
Static, pulsed and liquid crystal measurement results are presented for a 900um gate-width MESFET. T...
semiconductor device measurement; bipolar transistors; heterojunction bipolar transistors; analogue ...
In this brief, we present a novel noninvasive method for spatially resolved thermal measurement of ...
GaAs pHEMT thermal reliability test structures are introduced which incorporate on-wafer heating usi...
A thermal resistance measurement technique which exploits the thermal response of a GaAs pHEMT's gat...
Gate junction temperature is presented as the crucial parameter for modeling thermal degradation in ...
This paper presents a critical comparison of three different methods for the estimation of the therm...
The development of transient gate resistance thermometry (T-GRT) is reported. It is a technique used...
Self-heating in bipolar transistors, the effect which causes a rise in the device junction temperatu...
An electrothermal characterization of GaAs MESFET has been performed using pulsed measurements. The ...
Accurate and precise measurement of channel temperature for RF devices and especially for high power...
The temperature-dependent thermal conductivities of a GaAs pseudomorphic high-electron mobility tran...
Self heating in ultrashort gate length GaAs Pseudomorphic High Electron Mobility Transistors (PHEMT)...
This paper presents a study of the different phenomena that define the large signal behaviour of the...
Channel temperature Tch of GaAs MESFETs, determined by means of electrical measurements (\u394Vgs), ...
Static, pulsed and liquid crystal measurement results are presented for a 900um gate-width MESFET. T...
semiconductor device measurement; bipolar transistors; heterojunction bipolar transistors; analogue ...
In this brief, we present a novel noninvasive method for spatially resolved thermal measurement of ...
GaAs pHEMT thermal reliability test structures are introduced which incorporate on-wafer heating usi...
A thermal resistance measurement technique which exploits the thermal response of a GaAs pHEMT's gat...
Gate junction temperature is presented as the crucial parameter for modeling thermal degradation in ...
This paper presents a critical comparison of three different methods for the estimation of the therm...
The development of transient gate resistance thermometry (T-GRT) is reported. It is a technique used...
Self-heating in bipolar transistors, the effect which causes a rise in the device junction temperatu...
An electrothermal characterization of GaAs MESFET has been performed using pulsed measurements. The ...
Accurate and precise measurement of channel temperature for RF devices and especially for high power...
The temperature-dependent thermal conductivities of a GaAs pseudomorphic high-electron mobility tran...
Self heating in ultrashort gate length GaAs Pseudomorphic High Electron Mobility Transistors (PHEMT)...
This paper presents a study of the different phenomena that define the large signal behaviour of the...
Channel temperature Tch of GaAs MESFETs, determined by means of electrical measurements (\u394Vgs), ...
Static, pulsed and liquid crystal measurement results are presented for a 900um gate-width MESFET. T...
semiconductor device measurement; bipolar transistors; heterojunction bipolar transistors; analogue ...
In this brief, we present a novel noninvasive method for spatially resolved thermal measurement of ...