Add to ORKGThis work describes solder wave process and it‘s optimalization. It informs us about wave soldering and describes it’s fragments. Next it is described partition of fluxes and their properties. In practical part is described researching of defects on PCB’s and analysis of possible reason of defects, measurement of the weight of sprayed flux and measurement of solderable profile
For many years, wave soldering has been used as a production technology in the electronics industry....
Manufacturing of electronic boards (commonly referred as PCB) is a highly automated process that re...
This master’s thesis deals with measuring and evaluation of wetting for samples of different surface...
The investigation deals with quality improvement of wave soldering joints for printed circuit boards...
Process optimization on wave soldering machines in the IVP CA lines yields higher productivity and b...
The issues surrounding the conversion to lead-free assembly are multiple and varied. Logistics, cost...
The theoretical part of diploma thesis „Selection of a suitable type of flux for wave soldering”, is...
In today’s surface mount technology, developments are in progress to move towards green manufacturi...
In the Printed Circuit Board Assembly Industry, a well defined temperature profile in the preheat se...
The aim of this work is documentation of cases, where the problems appear of solder paste reflow pro...
The theoretical part of dissertation is devoted to familiarization with the process of assembly and ...
The manufacturing feasibility and attachment reliability of a series of newly developed lead-free so...
In surface mount technology, development toward green manufacturing by converting all leaded solderi...
The project deals with the processes of degreasing industry and testing new laser cleaning process, ...
This thesis deals with formation of defects on through-hole capacitors. Process of wave soldering an...
For many years, wave soldering has been used as a production technology in the electronics industry....
Manufacturing of electronic boards (commonly referred as PCB) is a highly automated process that re...
This master’s thesis deals with measuring and evaluation of wetting for samples of different surface...
The investigation deals with quality improvement of wave soldering joints for printed circuit boards...
Process optimization on wave soldering machines in the IVP CA lines yields higher productivity and b...
The issues surrounding the conversion to lead-free assembly are multiple and varied. Logistics, cost...
The theoretical part of diploma thesis „Selection of a suitable type of flux for wave soldering”, is...
In today’s surface mount technology, developments are in progress to move towards green manufacturi...
In the Printed Circuit Board Assembly Industry, a well defined temperature profile in the preheat se...
The aim of this work is documentation of cases, where the problems appear of solder paste reflow pro...
The theoretical part of dissertation is devoted to familiarization with the process of assembly and ...
The manufacturing feasibility and attachment reliability of a series of newly developed lead-free so...
In surface mount technology, development toward green manufacturing by converting all leaded solderi...
The project deals with the processes of degreasing industry and testing new laser cleaning process, ...
This thesis deals with formation of defects on through-hole capacitors. Process of wave soldering an...
For many years, wave soldering has been used as a production technology in the electronics industry....
Manufacturing of electronic boards (commonly referred as PCB) is a highly automated process that re...
This master’s thesis deals with measuring and evaluation of wetting for samples of different surface...