Design and realization of the pull strength measuring device for SMD

This thesis deals with the design and implementation of a device for measuring pull strength by surface mounted devices (SMD). It analyzes the theory of pull strength testing of solder joints with emphasis on standard IEC 62137-1-3 and describes the selection of components utilized to create mechanical construction and electrical parts. These electronic parts made or innovated in this work were control system based on microcontroler Atmega164P, power circuit for stepper motor and communication of measure equipment TEST 321 with PC. The whole design is complemented by simulation of mechanical stress to the critical components using ANSYS. The conclusion summarizes the most important parameters of this equipment