This work deals with the laser diode soldering. The theoretical part summarizes general and acquired findings about soldering technology and materials that occur in this process. It also describes factors that affect the reliability of solder joints. It is closely focused to the shaping of the solder joint and structure of intermetallic layer. The practical part of this work is focused on the design of equipment for laser diode soldering and subsequent shaping of the samples. The quality of soldered joint is compared against the quality of joint created using re-flow technology - remelting in in-line smelter. The structure and thickness of the intermetallic layer, the number and shape of the voids in the solder joints are compared
In the past few years diode lasers have evolved into tools for industrial manufacturing for instance...
Thesis deals with the optimization of process parameters during laser welding of aluminum alloys 500...
We report on the development of a dry lasersingulation process for Si-wafers with back side metalliz...
Recently, the laser soldering method has been introduced among electronic manufacturers because of i...
After the discovery of laser technology in the 1960s by Theodore H. Maiman at Hughes Research Labora...
In order to optimize the soldering process of laserbars onto heatsinks with Indium solder, several i...
Laser beam soldering (LBS) is a non-standard manufacturing process for electronic packaging and inte...
Ce travail de thèse porte sur le développement de la technique de brasage tendre par faisceau laser....
AbstractAside from conventional welding methods, laser welding of plastics has established itself as...
The paper deals with the integration of a light emitting diode (LED) into an additive manufactured m...
Due to the increasing integration and miniaturisation of microelectronic circuits laser radiation is...
For the packaging of a pump laser in butterfly package, the most crucial assembly step is the fiber-...
This paper presents the results of optimization on laser soldering parameters onto lead free solder ...
Laser welding will be an important welding process for different applications in aerospace , aircra...
The aim of this thesis is to investigate parameters influence in the laser welding of dissimilar met...
In the past few years diode lasers have evolved into tools for industrial manufacturing for instance...
Thesis deals with the optimization of process parameters during laser welding of aluminum alloys 500...
We report on the development of a dry lasersingulation process for Si-wafers with back side metalliz...
Recently, the laser soldering method has been introduced among electronic manufacturers because of i...
After the discovery of laser technology in the 1960s by Theodore H. Maiman at Hughes Research Labora...
In order to optimize the soldering process of laserbars onto heatsinks with Indium solder, several i...
Laser beam soldering (LBS) is a non-standard manufacturing process for electronic packaging and inte...
Ce travail de thèse porte sur le développement de la technique de brasage tendre par faisceau laser....
AbstractAside from conventional welding methods, laser welding of plastics has established itself as...
The paper deals with the integration of a light emitting diode (LED) into an additive manufactured m...
Due to the increasing integration and miniaturisation of microelectronic circuits laser radiation is...
For the packaging of a pump laser in butterfly package, the most crucial assembly step is the fiber-...
This paper presents the results of optimization on laser soldering parameters onto lead free solder ...
Laser welding will be an important welding process for different applications in aerospace , aircra...
The aim of this thesis is to investigate parameters influence in the laser welding of dissimilar met...
In the past few years diode lasers have evolved into tools for industrial manufacturing for instance...
Thesis deals with the optimization of process parameters during laser welding of aluminum alloys 500...
We report on the development of a dry lasersingulation process for Si-wafers with back side metalliz...