This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects
Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries m...
The continuous progress in material and component technology has generated new laser-based applicati...
Optoelectronic packaging is the art of turning well-performing demonstrators of working principles i...
Progress in integrated photonics enables development of integrated photonics circuits with new uniqu...
Besides the common fiber technologies like splicing, polishing and coating there is a demand for spe...
Abstract: Fiber pigtailing and packaging of nanowaveguide circuits are key technologies to realize n...
Silicon photonics is a new technology that should at least enable electronics and optics to be integ...
The photonic integrated circuits are required in the next generations of coherent terabit optical co...
Recent progress on novel photonics packaging concepts will be discussed, allowing for a dense integr...
Three-dimensional freeform optical waveguides, or photonic wired bonding (PWB), is a versatile techn...
Electrical-optical integration is a rapidly growing field with a strong potential for applications i...
The rapid development of nanophotonic chip devices combines the advantages of ultra-high miniaturiza...
Over the last 20 years, silicon photonics has revolutionized the field of integrated optics, providi...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering,...
Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Netwo...
Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries m...
The continuous progress in material and component technology has generated new laser-based applicati...
Optoelectronic packaging is the art of turning well-performing demonstrators of working principles i...
Progress in integrated photonics enables development of integrated photonics circuits with new uniqu...
Besides the common fiber technologies like splicing, polishing and coating there is a demand for spe...
Abstract: Fiber pigtailing and packaging of nanowaveguide circuits are key technologies to realize n...
Silicon photonics is a new technology that should at least enable electronics and optics to be integ...
The photonic integrated circuits are required in the next generations of coherent terabit optical co...
Recent progress on novel photonics packaging concepts will be discussed, allowing for a dense integr...
Three-dimensional freeform optical waveguides, or photonic wired bonding (PWB), is a versatile techn...
Electrical-optical integration is a rapidly growing field with a strong potential for applications i...
The rapid development of nanophotonic chip devices combines the advantages of ultra-high miniaturiza...
Over the last 20 years, silicon photonics has revolutionized the field of integrated optics, providi...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering,...
Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Netwo...
Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries m...
The continuous progress in material and component technology has generated new laser-based applicati...
Optoelectronic packaging is the art of turning well-performing demonstrators of working principles i...