This deliverable reports on 3D devices resulting from the vertical integration of pixel sensors and readout electronics. After 3D integration steps such as etching of through-silicon vias and backside metallization of readout integrated circuits, ASICs and sensors are interconnected to form a 3D pixel detector. Various 3D detectors have been devised in AIDA WP3 and their status and performance is assessed here
3D detectors are photodiode radiation detectors with n- and p-type electrode columns passing through...
This paper reports on the current status of the development of International Linear Collider vertex ...
3D silicon detectors are characterized by cylindrical electrodes perpendicular to the surface and pe...
The development of 3D vertical integration in the microelectronic industry brings along significant ...
The development of 3D vertical integration in the microelectronic industry brings along significant ...
High energy physics experiments at future particle accelerators set very demanding requirements on t...
Silicon sensors with a three-dimensional (3-D) architecture, in which the n and p electrodes penetra...
The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The Pixel detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The potential of 3D integration of sensors and readout electronics is being explored in view of the ...
The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The fabrication of 3D detectors which requires bulk micromachining of columnar electrodes has been r...
Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detec...
3D detectors are photodiode radiation detectors with n- and p-type electrode columns passing through...
This paper reports on the current status of the development of International Linear Collider vertex ...
3D silicon detectors are characterized by cylindrical electrodes perpendicular to the surface and pe...
The development of 3D vertical integration in the microelectronic industry brings along significant ...
The development of 3D vertical integration in the microelectronic industry brings along significant ...
High energy physics experiments at future particle accelerators set very demanding requirements on t...
Silicon sensors with a three-dimensional (3-D) architecture, in which the n and p electrodes penetra...
The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The Pixel detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The potential of 3D integration of sensors and readout electronics is being explored in view of the ...
The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron...
The fabrication of 3D detectors which requires bulk micromachining of columnar electrodes has been r...
Pixel detectors with cylindrical electrodes that penetrate the silicon substrate (so called 3D detec...
3D detectors are photodiode radiation detectors with n- and p-type electrode columns passing through...
This paper reports on the current status of the development of International Linear Collider vertex ...
3D silicon detectors are characterized by cylindrical electrodes perpendicular to the surface and pe...