Metal-Diamond Composites (Me-CD) are a novel class of materials which has typical applications in the field of thermal management. Usually, due to the high volume fraction of diamonds inside the matrix, the mechanical behavior of such materials is quite brittle with low level of fracture stress and strain. However, with advanced innovations in the sintering processes, it is possible to obtain composite materials with a good level of strength and toughness. The great advantage of these materials is the possibility to combine the high thermal and electrical conductivity of diamonds with the strength of metals. Aim of this work is the investigation of the mechanical behavior of Me-CD from quasi-static to high strain-rate loading conditions. Th...
Diamond has the highest thermal conductivity among naturally occurring materials and a relatively lo...
The increasing power density of electronic devices and components requires the development of new co...
For microelectronic circuits, the main type of failure is thermal fatigue, owing to the different th...
Metal-Diamond Composites (Me-CD) are a novel class of materials which has typical applications in th...
Metal Diamond Composites (Me-CD) are a new class of metal matrix composites that are exciting the in...
Metal Diamond Composites (Me-CD) are a new class of metal matrix composites that are exciting the in...
Diamond reinforced metals are being developed for use as highly sophisticated heat spreading materia...
The study of innovative collimators is essential to handle the high energy particle beams required t...
Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by g...
Cobalt is currently used in the production of diamond reinforced metal matrix composites (i.e. stone...
Chemistry of intermetallic bonded diamond is studied. The impact resistance and energies of intermet...
Polycrystalline diamond (PCD) materials are used in various applications, mainly as cutting tools fo...
Sintered diamonds are used in grinding because they offer better mechanical properties than conventi...
In this work, dispersion strengthening of copper by diamonds is explored. In particular, the influen...
In the present work several titanium alloys were evaluated as matrixes for diamond tools. The purpos...
Diamond has the highest thermal conductivity among naturally occurring materials and a relatively lo...
The increasing power density of electronic devices and components requires the development of new co...
For microelectronic circuits, the main type of failure is thermal fatigue, owing to the different th...
Metal-Diamond Composites (Me-CD) are a novel class of materials which has typical applications in th...
Metal Diamond Composites (Me-CD) are a new class of metal matrix composites that are exciting the in...
Metal Diamond Composites (Me-CD) are a new class of metal matrix composites that are exciting the in...
Diamond reinforced metals are being developed for use as highly sophisticated heat spreading materia...
The study of innovative collimators is essential to handle the high energy particle beams required t...
Diamond-based metal matrix composites have been made based on pure Al and eutectic Ag-3Si alloy by g...
Cobalt is currently used in the production of diamond reinforced metal matrix composites (i.e. stone...
Chemistry of intermetallic bonded diamond is studied. The impact resistance and energies of intermet...
Polycrystalline diamond (PCD) materials are used in various applications, mainly as cutting tools fo...
Sintered diamonds are used in grinding because they offer better mechanical properties than conventi...
In this work, dispersion strengthening of copper by diamonds is explored. In particular, the influen...
In the present work several titanium alloys were evaluated as matrixes for diamond tools. The purpos...
Diamond has the highest thermal conductivity among naturally occurring materials and a relatively lo...
The increasing power density of electronic devices and components requires the development of new co...
For microelectronic circuits, the main type of failure is thermal fatigue, owing to the different th...