Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2009.Cataloged from PDF version of thesis.Includes bibliographical references (p. 91-92).The throughput bounds of traditional interconnect networks in microprocessors are being pushed to their limits. In past single-core processors, the number of long global wires constituted only a small fraction of the total. However, with the emergence of multi-core systems, where each core must be able to communicate with each other as well as off-chip memory, global interconnects have become a major bottleneck. The solution has been proposed through integrated photonic networks, where multiple channels of information can be placed onto a single l...
This work presents a monolithically integrated synchronous optical receiver fabricated in a standard...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering,...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
The tremendous growth in computer processing power as a result of the microelectronics scaling deman...
In 2014, approximately eight trillion transistors were fabricated every second thanks to improvement...
Because of the need to move large amounts of data effienciently, optical based communications are a ...
Integrated circuit scaling has enabled a huge growth in processing capability, which necessitates a ...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
As computing systems and communication networks grow more complex, so is the need for higher bandwi...
We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receive...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
A monolithically integrated optoelectronic receiver with a low-capacitance on-chip pin photodiode is...
A 1.6 Gb/s receiver for optical communication has been designed and fabricated in a 0.25-μm CMOS pro...
This work presents a monolithically integrated synchronous optical receiver fabricated in a standard...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering,...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
The tremendous growth in computer processing power as a result of the microelectronics scaling deman...
In 2014, approximately eight trillion transistors were fabricated every second thanks to improvement...
Because of the need to move large amounts of data effienciently, optical based communications are a ...
Integrated circuit scaling has enabled a huge growth in processing capability, which necessitates a ...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
As computing systems and communication networks grow more complex, so is the need for higher bandwi...
We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receive...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
A monolithically integrated optoelectronic receiver with a low-capacitance on-chip pin photodiode is...
A 1.6 Gb/s receiver for optical communication has been designed and fabricated in a 0.25-μm CMOS pro...
This work presents a monolithically integrated synchronous optical receiver fabricated in a standard...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering,...