A component of the compressive stress that develops during deposition of polycrystalline thin films reversibly changes during interruptions of growth. The mechanism responsible for this phenomenon has been the subject of much recent speculation and experimental work. In this Letter, we have varied the in-plane grain size of columnar polycrystalline gold films with a fixed thickness, by varying their thermal history. Without a vacuum break, the stress in these films was then measured in situ during growth and during interruptions in growth. Homoepitaxial gold films were similarly characterized as part of this study. The inverse of the in-plane grain size and the corresponding reversible stress change were found to be proportional, with zero ...
Microstructural and texture evolution during grain growth in polycrystalline thin films was investig...
During film growth by a variety of techniques, intrinsic tensile stresses can be created by the coal...
The intrinsic compression that arises in polycrystalline thin films under high atomic mobility condi...
During deposition of polycrystalline gold thin films, a compressive stress develops that reversibly ...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, ...
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shr...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, ...
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shr...
International audienceIntrinsic stresses in vapor deposited thin films have been a topic of consider...
International audienceIntrinsic stresses in vapor deposited thin films have been a topic of consider...
This work presents the characterization of the stress-strain behavior of an electroplated gold layer...
Thin films on substrates are usually in a stressed state. An important, but trivial, contribution to...
Thin films on substrates are usually in a stressed state. An important, but trivial, contribution to...
Investigation of the morphology evolution of annealed polycrystalline Au(111) films by atomic force ...
International audienceThe dependence on thermal history of the plasticity mechanisms occurring in na...
Microstructural and texture evolution during grain growth in polycrystalline thin films was investig...
During film growth by a variety of techniques, intrinsic tensile stresses can be created by the coal...
The intrinsic compression that arises in polycrystalline thin films under high atomic mobility condi...
During deposition of polycrystalline gold thin films, a compressive stress develops that reversibly ...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, ...
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shr...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, ...
In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shr...
International audienceIntrinsic stresses in vapor deposited thin films have been a topic of consider...
International audienceIntrinsic stresses in vapor deposited thin films have been a topic of consider...
This work presents the characterization of the stress-strain behavior of an electroplated gold layer...
Thin films on substrates are usually in a stressed state. An important, but trivial, contribution to...
Thin films on substrates are usually in a stressed state. An important, but trivial, contribution to...
Investigation of the morphology evolution of annealed polycrystalline Au(111) films by atomic force ...
International audienceThe dependence on thermal history of the plasticity mechanisms occurring in na...
Microstructural and texture evolution during grain growth in polycrystalline thin films was investig...
During film growth by a variety of techniques, intrinsic tensile stresses can be created by the coal...
The intrinsic compression that arises in polycrystalline thin films under high atomic mobility condi...