Synchrotron Tomography for the Study of Void Formation in Internal Tin Nb$_{3}$Sn Superconductors

Haibel, A
Scheuerlein, C

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Publication date

September 2006

DOI

10.1109/TASC.2006.887546

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Abstract

Synchrotron absorption tomography has been applied for the study of voids formed during the thermal treatment of internal tin Nb$_{3}$Sn strands. Possible void formation mechanisms and in particular the effect of Sn phase transformations and melting are discussed based on a quantitative void description. Sn melting changes mainly the shape and volume of the individual voids but does not increase the total void volume in the strand

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Synchrotron Tomography for the Study of Void Formation in Internal Tin Nb$_{3}$Sn Superconductors

Abstract

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Synchrotron Tomography for the Study of Void Formation in Internal Tin Nb$_{3}$Sn Superconductors

Abstract

Extracted data

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