Ru4-xTax (x = 1,2,3) alloys are studied as absorber candidates for EUV low-n mask. We report the morphology, surface roughness as well as the chemical composition of the as-deposited alloy films for better theoretical model building of the EUVL absorber stack. Their refractive indices are reconstructed by optimizing measured EUV reflectivity data for the purpose of enabling rigorous EUVL imaging calculations in the future work. The stabilities (both physical and chemical) of these absorber candidates are verified which contribute to a long lifetime of the mask in its working environment. This includes the resistance assessments of the thin films against high temperature up to 500 °C, different mask cleaning solutions and hydrogen environmen...
The application of EUV lithography at the 7 nm node and below requires, among others, to reduce 3D m...
Extreme ultraviolet (EUV) lithography is being industrialized as the next candidate printing techniq...
Extreme ultraviolet (EUV) lithography with reflective photomasks continues to be a potential pattern...
Ru4-xTax (x = 1,2,3) alloys are studied as absorber candidates for EUV low-n mask. We report the mor...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
A refined model of an extreme ultraviolet (EUV) mask stack consisting of the Mo/Si multilayer coated...
Extreme ultraviolet (EUV) lithography is being industrialized as the next candidate printing techniq...
Extreme ultraviolet (EUV) lithography is being industrialized as the next candidate printing techniq...
Extreme ultraviolet (EUV) lithography is being industrialized as the next candidate printing techniq...
The application of EUV lithography at the 7 nm node and below requires, among others, to reduce 3D m...
The application of EUV lithography at the 7 nm node and below requires, among others, to reduce 3D m...
Extreme ultraviolet (EUV) lithography is being industrialized as the next candidate printing techniq...
Extreme ultraviolet (EUV) lithography with reflective photomasks continues to be a potential pattern...
Ru4-xTax (x = 1,2,3) alloys are studied as absorber candidates for EUV low-n mask. We report the mor...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
In next-generation EUV imaging for foundry N5 dimensions and beyond, inherent pitch- and orientation...
A refined model of an extreme ultraviolet (EUV) mask stack consisting of the Mo/Si multilayer coated...
Extreme ultraviolet (EUV) lithography is being industrialized as the next candidate printing techniq...
Extreme ultraviolet (EUV) lithography is being industrialized as the next candidate printing techniq...
Extreme ultraviolet (EUV) lithography is being industrialized as the next candidate printing techniq...
The application of EUV lithography at the 7 nm node and below requires, among others, to reduce 3D m...
The application of EUV lithography at the 7 nm node and below requires, among others, to reduce 3D m...
Extreme ultraviolet (EUV) lithography is being industrialized as the next candidate printing techniq...
Extreme ultraviolet (EUV) lithography with reflective photomasks continues to be a potential pattern...