Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Aeronautics and Astronautics, 2000.Also available online at the MIT Theses Online homepage ."June 2000."Includes bibliographical references (p. 84-85).The MIT Microengine Project is an on-going effort to build a MEMS based gas turbine engine and turbo generator. This thesis covers the development and testing of the packaging needed for the microengine and related devices. The packaging of the microengine includes the fluidic, electrical, and sensor connections that interface the engine with the supplies and instruments necessary for operation. Making connections to the device is difficult because each connection must be gastight, able to bond to a device made entirely of silicon...
Many MEMS (Micro Electro-Mechanic Systems) parts have to meet the requirements for vacuum packaging....
The paper presents some recent results obtained in the field of electronic packaging for MEMS. A sur...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...
The fluidic packaging of Power MEMS devices such as the MIT microengine and microrocket requires the...
This thesis describes the development of wafer-level, low temperature thin film packages. Two packag...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...
In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer ...
MEMS devices are microscale systems which are fabricated using micro fabrication techniques. MEMS sy...
The objective of this research program is to develop effective packaging techniques and methodologie...
Air-gap structures are of particular interest for packaging of microelectromechanical systems (MEMS)...
Microelectromechanical systems (MEMS) devices can be delicate structures sensitive to damage from ha...
Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circu...
The packaging of implanted devices is crucial if high reliability is to be achieved with an intended...
Localized heating and bonding techniques have been developed for hermetic and vacuum packaging of ME...
A MEMS-based Safety and Arming (S&A) device is being developed for the next generation of Navy t...
Many MEMS (Micro Electro-Mechanic Systems) parts have to meet the requirements for vacuum packaging....
The paper presents some recent results obtained in the field of electronic packaging for MEMS. A sur...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...
The fluidic packaging of Power MEMS devices such as the MIT microengine and microrocket requires the...
This thesis describes the development of wafer-level, low temperature thin film packages. Two packag...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...
In this paper, a high performance wafer-level vacuum packaging technology based on GSG triple-layer ...
MEMS devices are microscale systems which are fabricated using micro fabrication techniques. MEMS sy...
The objective of this research program is to develop effective packaging techniques and methodologie...
Air-gap structures are of particular interest for packaging of microelectromechanical systems (MEMS)...
Microelectromechanical systems (MEMS) devices can be delicate structures sensitive to damage from ha...
Microelectromechanical Systems (MEMS) packaging is much different from conventional integrated circu...
The packaging of implanted devices is crucial if high reliability is to be achieved with an intended...
Localized heating and bonding techniques have been developed for hermetic and vacuum packaging of ME...
A MEMS-based Safety and Arming (S&A) device is being developed for the next generation of Navy t...
Many MEMS (Micro Electro-Mechanic Systems) parts have to meet the requirements for vacuum packaging....
The paper presents some recent results obtained in the field of electronic packaging for MEMS. A sur...
Results of wafer level packaging for micro-electro-mechanical systems based on low temperature melti...