Add to ORKGThesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.Includes bibliographical references (leaves 101-105).by Lalitha Parameswaran.M.S
A miniature pressure sensor head is designed and fabricated using an ultra-thin silicon membrane dir...
A novel high-temperature pressure sensor was designed based on the principle of magnetic induction. ...
This paper presents a novel high temperature SOI pressure sensor utilizing Cu-Sn wafer level bonding...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
In this thesis, the design and fabrication of a bulk micromachined and wafer bonded pressure sensor ...
Wafer bonding techniques play a key role in the present day silicon bulk micromachining for MEMS bas...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Ph.D.Electrical engineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp:...
311-316Wafer bonding techniques play a key role in the present day silicon bulk micromachining for M...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Of all micro sensors the silicon pressure sensors have the largest market potential. It will remain ...
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Since the discovery of piezoresistivity in silicon in the mid 1950s, silicon-based pressure sensors ...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
A miniature pressure sensor head is designed and fabricated using an ultra-thin silicon membrane dir...
A novel high-temperature pressure sensor was designed based on the principle of magnetic induction. ...
This paper presents a novel high temperature SOI pressure sensor utilizing Cu-Sn wafer level bonding...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
In this thesis, the design and fabrication of a bulk micromachined and wafer bonded pressure sensor ...
Wafer bonding techniques play a key role in the present day silicon bulk micromachining for MEMS bas...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Ph.D.Electrical engineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp:...
311-316Wafer bonding techniques play a key role in the present day silicon bulk micromachining for M...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
Of all micro sensors the silicon pressure sensors have the largest market potential. It will remain ...
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
Since the discovery of piezoresistivity in silicon in the mid 1950s, silicon-based pressure sensors ...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
A miniature pressure sensor head is designed and fabricated using an ultra-thin silicon membrane dir...
A novel high-temperature pressure sensor was designed based on the principle of magnetic induction. ...
This paper presents a novel high temperature SOI pressure sensor utilizing Cu-Sn wafer level bonding...