Add to ORKGThesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1992.Includes bibliographical references (leaves 84-85)by Julie Gupta.M.S
Experimental measurements and computational results for the evolution of plastic deformation in free...
textThermomechanical stresses in the copper interconnects are directly related to void formation an...
The resistance and Cu(111) x-ray intensity of Cu and dilute binary Cu alloy films were measured as a...
We are in the midst of a major technology transition from alumni to copper as the metallization mate...
Stress and resistivity in sputtered copper films on glass and polyimide (Kapton H) substrates were s...
The constitutive behavior of passivated copper films is studied. Stresses in copper films of thickne...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Civil Engineering, 1990.Includes bi...
Copper films of different thicknesses of 0.2, 0.5, 1 and 2 microns were electroplated on top of the ...
Copper thin films have been deposited by means of three different techniques. Transmission electron ...
International audienceComparative studies of the mechanical behavior between copper, tungsten, and W...
Production of thin (10 to 200 microns thick) metallic (Cu, CO and Ni-P) foils is performed by electr...
The resistive and structural properties of chromium and chromium-copper alloy films were found to va...
科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2) ・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究
In this study we compare the influence of the microstructure and of chemical composition on resistiv...
The texture and stress properties of barrier layers on three types of low-k materials for copper (Cu...
Experimental measurements and computational results for the evolution of plastic deformation in free...
textThermomechanical stresses in the copper interconnects are directly related to void formation an...
The resistance and Cu(111) x-ray intensity of Cu and dilute binary Cu alloy films were measured as a...
We are in the midst of a major technology transition from alumni to copper as the metallization mate...
Stress and resistivity in sputtered copper films on glass and polyimide (Kapton H) substrates were s...
The constitutive behavior of passivated copper films is studied. Stresses in copper films of thickne...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Civil Engineering, 1990.Includes bi...
Copper films of different thicknesses of 0.2, 0.5, 1 and 2 microns were electroplated on top of the ...
Copper thin films have been deposited by means of three different techniques. Transmission electron ...
International audienceComparative studies of the mechanical behavior between copper, tungsten, and W...
Production of thin (10 to 200 microns thick) metallic (Cu, CO and Ni-P) foils is performed by electr...
The resistive and structural properties of chromium and chromium-copper alloy films were found to va...
科研費報告書収録論文(課題番号:13450281・基盤研究(B)(2) ・H13～H15/研究代表者:小池, 淳一/超高速LSI用Cu配線におけるボイド形成機構の研究
In this study we compare the influence of the microstructure and of chemical composition on resistiv...
The texture and stress properties of barrier layers on three types of low-k materials for copper (Cu...
Experimental measurements and computational results for the evolution of plastic deformation in free...
textThermomechanical stresses in the copper interconnects are directly related to void formation an...
The resistance and Cu(111) x-ray intensity of Cu and dilute binary Cu alloy films were measured as a...