This paper describes recent progress in a continuing program to develop and apply RM³ (recess mounting with monolithic metallization) technologies for heterogeneous integration. Particular emphasis is placed on the applicability of RM³ integration to in-plane geometries for on-chip optical clock and signal distribution and on the suitability of commercially processed IC wafers for use as substrates for rectangular dielectric waveguides.Singapore-MIT Alliance (SMA
The Information Revolution and enabling era of silicon ul-tralarge-scale integration (ULSI) have spa...
Heterogeneous integration of III-V material, accomplished via a metal-eutectic bond, followed by fab...
We present results on the direct monolithic integration of III-V devices and Si CMOS on a silicon su...
This paper describes recent progress in a continuing program to develop and apply RM³ (recess mounti...
Chip-to-chip optical interconnect technology, which is being explored as a potential replacement for...
The system study exhibits crossconnect systems for optical switching applications in the near future...
Summary. Silicon microphotonics is to integrate photonic functionalities on Si chips to extend Si ch...
Abstract. Substrate Integrated Waveguide (SIW) tech-nology is the most promising candidate for the i...
We summarize our work on creating substrate platforms, processes, and devices for the monolithic int...
Photonics on CMOS is the integration of microelectronics technology and optics components to enable ...
Photonic integration in ULSI electronic circuits contributes three new functionalities that are crit...
Technologies to design and fabricate high-bit-rate chip-to-chip optical interconnects on printed wir...
© 2005 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for a...
We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking ...
This dissertation presents a novel prototype optical interconnect system achieved by MEMS technology...
The Information Revolution and enabling era of silicon ul-tralarge-scale integration (ULSI) have spa...
Heterogeneous integration of III-V material, accomplished via a metal-eutectic bond, followed by fab...
We present results on the direct monolithic integration of III-V devices and Si CMOS on a silicon su...
This paper describes recent progress in a continuing program to develop and apply RM³ (recess mounti...
Chip-to-chip optical interconnect technology, which is being explored as a potential replacement for...
The system study exhibits crossconnect systems for optical switching applications in the near future...
Summary. Silicon microphotonics is to integrate photonic functionalities on Si chips to extend Si ch...
Abstract. Substrate Integrated Waveguide (SIW) tech-nology is the most promising candidate for the i...
We summarize our work on creating substrate platforms, processes, and devices for the monolithic int...
Photonics on CMOS is the integration of microelectronics technology and optics components to enable ...
Photonic integration in ULSI electronic circuits contributes three new functionalities that are crit...
Technologies to design and fabricate high-bit-rate chip-to-chip optical interconnects on printed wir...
© 2005 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for a...
We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking ...
This dissertation presents a novel prototype optical interconnect system achieved by MEMS technology...
The Information Revolution and enabling era of silicon ul-tralarge-scale integration (ULSI) have spa...
Heterogeneous integration of III-V material, accomplished via a metal-eutectic bond, followed by fab...
We present results on the direct monolithic integration of III-V devices and Si CMOS on a silicon su...