Institute for Computing Systems ArchitectureThe interconnect mechanisms (shared bus or crossbar) used in current chip-multiprocessors (CMPs) are expected to become a bottleneck that prevents these architectures from scaling to a larger number of cores. Tiled CMPs offer better scalability by integrating relatively simple cores with a lightweight point-to-point interconnect. However, such interconnects make snooping impractical and, thus, require alternative solutions to cache coherence. This thesis proposes a novel, cost-effective hardware mechanism to support shared-memory parallel applications that forgoes hardware maintained cache coherence. The proposed mech- anism is based on the key ideas that mapping of lines to physical caches...
The evolution of microprocessor design in the last few decades has changed significantly, moving fro...
It is clear that multicore processors have become the building blocks of today’s high-performance co...
With the advancement of design and fabrication of high-performance integrated circuits technology, i...
The interconnect mechanisms (shared bus or crossbar) used in current chip-multiprocessors (CMPs) are...
Abstract The interconnect mechanisms (shared bus or crossbar) used in current chip-multiprocessors (...
On the road to computer systems able to support the requirements of exascale applications, Chip Mult...
Due to VLSI lithography problems and the limitation of additional architectural enhancements uniproc...
Design complexity and limited power budget are causing the number of cores on the same chip to grow ...
We argue that OS-provided data coherence on non-cache-coherent NUMA multiprocessors (machines with a...
The era of billion and more transistors on a single silicon chip has already begun and this has chan...
textThis dissertation explores techniques for reducing the costs of inter-processor communication i...
The rising core count per processor is pushing chip complexity to a level that hardware-based cache...
Thesis (M. Eng. and S.B.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering an...
As transistor density continues to grow geometrically, processor manufacturers are already able to p...
dissertationWith the explosion of chip transistor counts, the semiconductor industry has struggled w...
The evolution of microprocessor design in the last few decades has changed significantly, moving fro...
It is clear that multicore processors have become the building blocks of today’s high-performance co...
With the advancement of design and fabrication of high-performance integrated circuits technology, i...
The interconnect mechanisms (shared bus or crossbar) used in current chip-multiprocessors (CMPs) are...
Abstract The interconnect mechanisms (shared bus or crossbar) used in current chip-multiprocessors (...
On the road to computer systems able to support the requirements of exascale applications, Chip Mult...
Due to VLSI lithography problems and the limitation of additional architectural enhancements uniproc...
Design complexity and limited power budget are causing the number of cores on the same chip to grow ...
We argue that OS-provided data coherence on non-cache-coherent NUMA multiprocessors (machines with a...
The era of billion and more transistors on a single silicon chip has already begun and this has chan...
textThis dissertation explores techniques for reducing the costs of inter-processor communication i...
The rising core count per processor is pushing chip complexity to a level that hardware-based cache...
Thesis (M. Eng. and S.B.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering an...
As transistor density continues to grow geometrically, processor manufacturers are already able to p...
dissertationWith the explosion of chip transistor counts, the semiconductor industry has struggled w...
The evolution of microprocessor design in the last few decades has changed significantly, moving fro...
It is clear that multicore processors have become the building blocks of today’s high-performance co...
With the advancement of design and fabrication of high-performance integrated circuits technology, i...