The development of a beam-leaded low power, high performance metal-oxide-semiconductor (MOS), 256-bit random access memory (RAM) was reported. Previous success with the aluminum-gate current-sense version and a silicon-gate voltage-sense version led to the present effort to make a beam-leaded silicon-gate RAM. Some problems unique to the silicon-on-sapphire beam-lead process development are presented. Beam-leaded SOS TA5388 devices using a Si3N4 passivation layer were shown to have good electrical parameters
Fabrication technique for direct interconnection of uncased silicon integrated circuit chip
Destructive and nondestructive testing, results, and specifications for reliability of integrated ci...
International Telemetering Conference Proceedings / November 14-16, 1978 / Hyatt House Hotel, Los An...
The development of a low power, high performance MOS 256-bit random assess memory with beam leads is...
The design of a MOS 256-bit Random Access Memory (RAM) is discussed. Technological achievements comp...
Continuing development and expansion of a series of P-channel MOSFET circuits in flight data systems...
The results are presented of a program to demonstrate the processes for fabricating complementary MI...
The results are presented of a comprehensive study and evaluation for the bonding of flip chip and b...
Beam lead technology for microcircuit interconnections with applications to metallization, passivati...
The use of aluminum beam lead devices in hybrid circuits is described by modification of existing pr...
A literature survey is presented covering nondestructive methods of electrical characterization of s...
Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determine...
Recent work for the NASA Electronic Parts and Packaging Program Power MOSFET task is presented. The ...
The technologies of low power TTL and beam lead processing were merged into a single product family....
Large scale integration microelectronic wafer and package testing including parametric and functiona...
Fabrication technique for direct interconnection of uncased silicon integrated circuit chip
Destructive and nondestructive testing, results, and specifications for reliability of integrated ci...
International Telemetering Conference Proceedings / November 14-16, 1978 / Hyatt House Hotel, Los An...
The development of a low power, high performance MOS 256-bit random assess memory with beam leads is...
The design of a MOS 256-bit Random Access Memory (RAM) is discussed. Technological achievements comp...
Continuing development and expansion of a series of P-channel MOSFET circuits in flight data systems...
The results are presented of a program to demonstrate the processes for fabricating complementary MI...
The results are presented of a comprehensive study and evaluation for the bonding of flip chip and b...
Beam lead technology for microcircuit interconnections with applications to metallization, passivati...
The use of aluminum beam lead devices in hybrid circuits is described by modification of existing pr...
A literature survey is presented covering nondestructive methods of electrical characterization of s...
Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determine...
Recent work for the NASA Electronic Parts and Packaging Program Power MOSFET task is presented. The ...
The technologies of low power TTL and beam lead processing were merged into a single product family....
Large scale integration microelectronic wafer and package testing including parametric and functiona...
Fabrication technique for direct interconnection of uncased silicon integrated circuit chip
Destructive and nondestructive testing, results, and specifications for reliability of integrated ci...
International Telemetering Conference Proceedings / November 14-16, 1978 / Hyatt House Hotel, Los An...