The friction characteristics of polyimide films bonded to metallic substrates were studied from 25 to 500 C. These results were correlated to molecular structure and the results of torsional braid analysis (TBA). A large friction transition (0.23 to 0.03) was found to occur at 45 C + or - 5 C. It was postulated that this transition was initiated by some molecular relaxation, which gave the molecules a degree of freedom by which an external mechanical stress could rearrange the molecules into a structure, such as an extended chain, which is conducive to easy shear. Above 300 C the friction characteristics were found to be dependent on the thermal prehistory of the film
Preliminary tribological studies on polyimides formulated from the diamine 2,2-bis 4-(4-aminophenoxy...
Physical and chemical properties vary with temperature. In a sliding contact between a pair of mater...
Thermal exposure experiments at 315 and 350 C were performed in air on nine different types of polyi...
The friction characteristics of polyimide films bonded to metallic substrates were studied from 25 t...
Friction, wear, and wear mechanisms of several different polyimide films, solid bodies, composites, ...
Friction and wear experiments conducted on polyimide films bonded to 440C stainless steel disks indi...
Friction and wear experiments conducted on polyimide films bonded to 440C stainless steel disks indi...
The tribological properties of seven polyimide films applied to 440 C high temperature stainless ste...
A pin-on-disk type of friction and wear apparatus was used to study the tribological properties of s...
Prepared at Lewis Research Center.Cover title.Includes bibliographical references (p. 14-18).Mode of...
The tribological properties of polyimide dry films and composites are reviewed. Friction coefficient...
The effect of thermal exposure on the weight loss, adherence, friction, and wear properties of polyi...
A transition in the friction coefficient and wear life properties of Pyralin polyimide (PI) thin fil...
Tribological studies were conducted on five different polyimide solid bodies formulated from the dia...
A friction and wear life study was conducted on the use of a polyimide (PI) varnish as a binder for ...
Preliminary tribological studies on polyimides formulated from the diamine 2,2-bis 4-(4-aminophenoxy...
Physical and chemical properties vary with temperature. In a sliding contact between a pair of mater...
Thermal exposure experiments at 315 and 350 C were performed in air on nine different types of polyi...
The friction characteristics of polyimide films bonded to metallic substrates were studied from 25 t...
Friction, wear, and wear mechanisms of several different polyimide films, solid bodies, composites, ...
Friction and wear experiments conducted on polyimide films bonded to 440C stainless steel disks indi...
Friction and wear experiments conducted on polyimide films bonded to 440C stainless steel disks indi...
The tribological properties of seven polyimide films applied to 440 C high temperature stainless ste...
A pin-on-disk type of friction and wear apparatus was used to study the tribological properties of s...
Prepared at Lewis Research Center.Cover title.Includes bibliographical references (p. 14-18).Mode of...
The tribological properties of polyimide dry films and composites are reviewed. Friction coefficient...
The effect of thermal exposure on the weight loss, adherence, friction, and wear properties of polyi...
A transition in the friction coefficient and wear life properties of Pyralin polyimide (PI) thin fil...
Tribological studies were conducted on five different polyimide solid bodies formulated from the dia...
A friction and wear life study was conducted on the use of a polyimide (PI) varnish as a binder for ...
Preliminary tribological studies on polyimides formulated from the diamine 2,2-bis 4-(4-aminophenoxy...
Physical and chemical properties vary with temperature. In a sliding contact between a pair of mater...
Thermal exposure experiments at 315 and 350 C were performed in air on nine different types of polyi...