Add to ORKGA process of preparing aromatic polyamide-acids for use as adhesives is described. An equimolar quantity of an aromatic dianhydride is added to a stirred solution of an aromatic diamine in a water or alcohol-miscible ether solvent to obtain a viscous polymer solution. The polymeric-acid intermediate polymer does not become insoluble but directly forms a smooth viscous polymer solution. These polyamic-acid polymers are converted, by heating in the range of 200-300 C and with pressure, to form polyimides with excellent adhesive properties
Adhesive based polyimide solutions which are more easily processed than conventional aromatic polyim...
Future civilian aircraft will require the use of advanced adhesive systems with high temperature cap...
Polyimides of a recently developed type have an attractive combination of properties, including low ...
High bonding strengths are obtained for metals and fiber-reinforced organic resin composites with no...
A meta-oriented aromatic diamine is reacted with an aromatic dianhydride and an aluminum compound in...
Adhesive development is directed towards elevated temperature applications (200-300 C). Because of t...
The aerospace and electronics industries have an ever increasing need for higher performance materia...
A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by c...
The invention is a process for the production of solid aromatic polyamic acid and polyimide fibers f...
A copolyimide was prepared by reacting 3,4'-oxydianiline (3,4'-ODA) with a dianhydride blend compris...
Four phenylethynyl amine compounds - 3 and 4-aminophenoxy-4'-phenylethynylbenzophenone, and 3 and 4-...
Polyimide resins (PMR) are generally useful where high strength and temperature capabilities are req...
An assembly of an article and a polyimide composition is prepared. The assembly resists dimensional ...
Tough, soluble, aromatic, thermoplastic copolyimides were prepared by reacting 4,4'-oxydiphthalic an...
A solvent resistant copolyimide was prepared by reacting 4,4'-oxydiphthalic anhydride with a diamine...
Adhesive based polyimide solutions which are more easily processed than conventional aromatic polyim...
Future civilian aircraft will require the use of advanced adhesive systems with high temperature cap...
Polyimides of a recently developed type have an attractive combination of properties, including low ...
High bonding strengths are obtained for metals and fiber-reinforced organic resin composites with no...
A meta-oriented aromatic diamine is reacted with an aromatic dianhydride and an aluminum compound in...
Adhesive development is directed towards elevated temperature applications (200-300 C). Because of t...
The aerospace and electronics industries have an ever increasing need for higher performance materia...
A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by c...
The invention is a process for the production of solid aromatic polyamic acid and polyimide fibers f...
A copolyimide was prepared by reacting 3,4'-oxydianiline (3,4'-ODA) with a dianhydride blend compris...
Four phenylethynyl amine compounds - 3 and 4-aminophenoxy-4'-phenylethynylbenzophenone, and 3 and 4-...
Polyimide resins (PMR) are generally useful where high strength and temperature capabilities are req...
An assembly of an article and a polyimide composition is prepared. The assembly resists dimensional ...
Tough, soluble, aromatic, thermoplastic copolyimides were prepared by reacting 4,4'-oxydiphthalic an...
A solvent resistant copolyimide was prepared by reacting 4,4'-oxydiphthalic anhydride with a diamine...
Adhesive based polyimide solutions which are more easily processed than conventional aromatic polyim...
Future civilian aircraft will require the use of advanced adhesive systems with high temperature cap...
Polyimides of a recently developed type have an attractive combination of properties, including low ...