Add to ORKGAn analytical model of a blister type specimen for evaluating adhesive bond strength was developed. Plate theory with shear deformation was used to model the deformation of the plate, and elastic deformation of the adhesive layer is taken into account. It is shown that the inclusion of the elastic deformation of the adhesive layer can have a significant influence in the energy balance calculations of fracture mechanics
This study investigates the effect of adhesive thickness on the transverse low-speed impact behavior...
In this study, a transversely isotropic elastic layer bonded to a rigid substrate is considered, wit...
Thick adhesive layers have potential structural application in ship construction for the joining of ...
AbstractAn experimental method to determine the complete stress versus deformation relation for a th...
The blister test geometry commonly used for the measurement of interfacial work of adhesion W has be...
This thesis focuses on the refinement and application of the island blister test (IBT) initially pro...
The crack extension force has been calculated for the blister test when the blister is in transition...
The ability to accurately measure surface and interfacial energies affects our understanding of fric...
Mechanical models are developed to determine the mode I and II adhesion toughness of monolayer thin ...
The mechanical integrity of thin films is characterized by the adhesion between solid bodies and mem...
Interdependence of continuum mechanics and physical chemistry in failure analysis of adhesive
Circular blisters and telephone cord blisters (TCBs) can spontaneously occur in thin films under con...
Mechanical models are developed to determine the mode I and II adhesion toughness of monolayer thin ...
Adhesive joining is today viewed as one of the key technologies to achieve decreased emissions in th...
AbstractTime independent inelasticity is often modelled as due to plasticity and/or damage. The diff...
This study investigates the effect of adhesive thickness on the transverse low-speed impact behavior...
In this study, a transversely isotropic elastic layer bonded to a rigid substrate is considered, wit...
Thick adhesive layers have potential structural application in ship construction for the joining of ...
AbstractAn experimental method to determine the complete stress versus deformation relation for a th...
The blister test geometry commonly used for the measurement of interfacial work of adhesion W has be...
This thesis focuses on the refinement and application of the island blister test (IBT) initially pro...
The crack extension force has been calculated for the blister test when the blister is in transition...
The ability to accurately measure surface and interfacial energies affects our understanding of fric...
Mechanical models are developed to determine the mode I and II adhesion toughness of monolayer thin ...
The mechanical integrity of thin films is characterized by the adhesion between solid bodies and mem...
Interdependence of continuum mechanics and physical chemistry in failure analysis of adhesive
Circular blisters and telephone cord blisters (TCBs) can spontaneously occur in thin films under con...
Mechanical models are developed to determine the mode I and II adhesion toughness of monolayer thin ...
Adhesive joining is today viewed as one of the key technologies to achieve decreased emissions in th...
AbstractTime independent inelasticity is often modelled as due to plasticity and/or damage. The diff...
This study investigates the effect of adhesive thickness on the transverse low-speed impact behavior...
In this study, a transversely isotropic elastic layer bonded to a rigid substrate is considered, wit...
Thick adhesive layers have potential structural application in ship construction for the joining of ...