Stress concentration in the vicinity of a hole defect under conditions of Hertzian contact

Two dimensional photoelastic stress analyses were conducted for epoxy resin models containing a hole defect under the conditions of Hertzian contact. Stress concentrations around the defect were determined as a function of several parameters. The effect of tangential traction on the stress concentration was also determined. Sharp stress concentrations occur in the vicinity of both the left and the right side of the hole. The stress concentration becomes more distinct the larger the hole diameter and the smaller distance between the hole and the contact surface. The stress concentration is greatest when the disk imposing a normal load is located at the contact surface directly over the hole. The magnitude and the location of stress concentration varies with the distance between the Hertzian contact area and the hole. The area involved in a process of rolling contact fatigue is confined to a shallow region at both sides of the hole. It was found that the effect of tangential traction is comparatively small on the stress concentration around the hole