Simulations of various phosphorus and boron diffusions in SOS were completed and a sputtering system, furnaces, and photolithography related equipment were set up. Double layer metal experiments initially utilized wet chemistry techniques. By incorporating ultrasonic etching of the vias, premetal cleaning a modified buffered HF, phosphorus doped vapox, and extended sintering, yields of 98% were obtained using the standard test pattern. A two dimensional modeling program was written for simulating short channel MOSFETs with nonuniform substrate doping. A key simplifying assumption used is that the majority carriers can be represented by a sheet charge at the silicon dioxide silicon interface. Although the program is incomplete, the two dimen...
Double-gate metal-oxide-semiconductor field-effect transistors (DG MOSFETs) are promising candidates...
The current status of NBS work on measurement technology for semiconductor materials, process contro...
A semiconductor diffusion and oxidation facility (totally automated) was developed. Wafers arrived o...
The use of dry processing and alternate dielectrics for processing wafers is reported. A two dimensi...
Developments in the fields of semiconductors and magnetics are surveyed. Materials, devices, theory,...
Instability, high threshold voltage and gamma radiation sensitivity of metal-oxide-silicon transisto...
In an investigation of metal oxide semiconductor field effect transistor (MOFSET) devices, a one-dim...
Causes of instability, high threshold voltage, and gamma radiation sensitivity of metal-oxide silico...
Interrelation of process techniques and space radiation effects in metal oxide semiconductor
The realization of high yield double layer metal systems using wet chemistry processes and the abili...
Chemical deposition of silicon dioxide films by tetraethyl orthosilicate decomposition and doped sil...
Low-melting phosphate and borate glasses were screen printed on silicon wafers and heated to form n ...
The 2D Monte Carlo Device Simulator as previously developed in the project NT 2707 A4 has been subst...
We present a hierarchical approach to the 'atomistic' simulation of aggressively scaled sub-0.1-μm ...
A two dimensional process simulator-MO.BI.DI.C- has been developed. The program can simulate ion imp...
Double-gate metal-oxide-semiconductor field-effect transistors (DG MOSFETs) are promising candidates...
The current status of NBS work on measurement technology for semiconductor materials, process contro...
A semiconductor diffusion and oxidation facility (totally automated) was developed. Wafers arrived o...
The use of dry processing and alternate dielectrics for processing wafers is reported. A two dimensi...
Developments in the fields of semiconductors and magnetics are surveyed. Materials, devices, theory,...
Instability, high threshold voltage and gamma radiation sensitivity of metal-oxide-silicon transisto...
In an investigation of metal oxide semiconductor field effect transistor (MOFSET) devices, a one-dim...
Causes of instability, high threshold voltage, and gamma radiation sensitivity of metal-oxide silico...
Interrelation of process techniques and space radiation effects in metal oxide semiconductor
The realization of high yield double layer metal systems using wet chemistry processes and the abili...
Chemical deposition of silicon dioxide films by tetraethyl orthosilicate decomposition and doped sil...
Low-melting phosphate and borate glasses were screen printed on silicon wafers and heated to form n ...
The 2D Monte Carlo Device Simulator as previously developed in the project NT 2707 A4 has been subst...
We present a hierarchical approach to the 'atomistic' simulation of aggressively scaled sub-0.1-μm ...
A two dimensional process simulator-MO.BI.DI.C- has been developed. The program can simulate ion imp...
Double-gate metal-oxide-semiconductor field-effect transistors (DG MOSFETs) are promising candidates...
The current status of NBS work on measurement technology for semiconductor materials, process contro...
A semiconductor diffusion and oxidation facility (totally automated) was developed. Wafers arrived o...