Add to ORKGA semiconductor diffusion and oxidation facility (totally automated) was developed. Wafers arrived on an air track, automatically loaded into a furnace tube, processed, returned to track, and sent on to the next process. The entire process was controlled by a computer
A cleaning and drying system for processing at least 2500 three in. diameter wafers per hour was dev...
Simulations of various phosphorus and boron diffusions in SOS were completed and a sputtering system...
Dry processing - both etching and deposition - and present/future trends in semiconductor technology...
A totally automated facility for semiconductor oxidation and diffusion was developed using a state-o...
A semiconductor vacuum chemical vapor deposition facility (totally automatic) was developed. Wafers ...
Chemical etching for automatic processing of integrated circuits is discussed. The wafer carrier and...
Chemical deposition of silicon dioxide films by tetraethyl orthosilicate decomposition and doped sil...
This paper deals with replacing a dry oxidation with a wet oxidation process during low pressure dif...
The operations analysis and equipment evaluations pertinent to the design of an automated production...
The two manufacturing concepts developed represent innovative, technologically advanced manufacturin...
It is recommended that various techniques be investigated which appear to have the potential for imp...
Automation reuirements were developed for two manufacturing concepts: (1) Gallium Arsenide Electroep...
The electroepitaxial process and the Very Large Scale Integration (VLSI) circuits (chips) facilities...
A sputtering system was developed to deposit aluminum and aluminum alloys by the dc sputtering techn...
The oxidation of silicon and the diffusion of boron into siliconhave been investigated together with...
A cleaning and drying system for processing at least 2500 three in. diameter wafers per hour was dev...
Simulations of various phosphorus and boron diffusions in SOS were completed and a sputtering system...
Dry processing - both etching and deposition - and present/future trends in semiconductor technology...
A totally automated facility for semiconductor oxidation and diffusion was developed using a state-o...
A semiconductor vacuum chemical vapor deposition facility (totally automatic) was developed. Wafers ...
Chemical etching for automatic processing of integrated circuits is discussed. The wafer carrier and...
Chemical deposition of silicon dioxide films by tetraethyl orthosilicate decomposition and doped sil...
This paper deals with replacing a dry oxidation with a wet oxidation process during low pressure dif...
The operations analysis and equipment evaluations pertinent to the design of an automated production...
The two manufacturing concepts developed represent innovative, technologically advanced manufacturin...
It is recommended that various techniques be investigated which appear to have the potential for imp...
Automation reuirements were developed for two manufacturing concepts: (1) Gallium Arsenide Electroep...
The electroepitaxial process and the Very Large Scale Integration (VLSI) circuits (chips) facilities...
A sputtering system was developed to deposit aluminum and aluminum alloys by the dc sputtering techn...
The oxidation of silicon and the diffusion of boron into siliconhave been investigated together with...
A cleaning and drying system for processing at least 2500 three in. diameter wafers per hour was dev...
Simulations of various phosphorus and boron diffusions in SOS were completed and a sputtering system...
Dry processing - both etching and deposition - and present/future trends in semiconductor technology...