Add to ORKGSolar cells were produced using a Mo/Sn/TiH screen printed paste with a lead/borosilicate frit that are electrically comparable to control silver cells. The process is currently unsuccessful because the soldering of interconnects to these cells has proved difficult. Future work will investigate using CO instead of H2 as the reducing gas and putting an ITO coating on the cell prior to metallization
A low cost ohmic contact on silicon solar cells based on molybdenum-tin metal systems was developed....
Printed nickel overplated with copper and applied on top of a predeposited silicon nitride antirefle...
AbstractThis work deals with requirements regarding the solar cell process that allow or facilitate ...
The use of CO in place of H2 for the reducing step did not appreciably increase solderability of int...
The optimization, evaluation, and demonstration of a novel metallization applied by a screen printin...
New pastes were evaluated that contained additives to aid in the silicon-to-metallization contact. N...
Solar cells without AR coating achieved efficiencies of 10.5% with the Type A Mo/Sn/TiH paste. Curve...
A non lead frit paste is evaluated. A two step process is discussed where the bulk of the metallizat...
The objectives of the investigation were to provide all-metal screenable pastes using economical bas...
An economical thick film solar cell contact for high volume production of low cost silicon solar arr...
Electrodes made with pastes produced under the previous contract were analyzed and compared with raw...
Silicon nitride and nickel pastes are investigated in conjunction with a brush copper plating proces...
Improved thick film solar cell contacts for the high volume production of low cost silicon solar arr...
AbstractThe screen printing metallization of p+ surfaces is one of the challenges for the industrial...
The experimental work demonstrating the feasibility of the MIDFILM process as a low cost means of ap...
A low cost ohmic contact on silicon solar cells based on molybdenum-tin metal systems was developed....
Printed nickel overplated with copper and applied on top of a predeposited silicon nitride antirefle...
AbstractThis work deals with requirements regarding the solar cell process that allow or facilitate ...
The use of CO in place of H2 for the reducing step did not appreciably increase solderability of int...
The optimization, evaluation, and demonstration of a novel metallization applied by a screen printin...
New pastes were evaluated that contained additives to aid in the silicon-to-metallization contact. N...
Solar cells without AR coating achieved efficiencies of 10.5% with the Type A Mo/Sn/TiH paste. Curve...
A non lead frit paste is evaluated. A two step process is discussed where the bulk of the metallizat...
The objectives of the investigation were to provide all-metal screenable pastes using economical bas...
An economical thick film solar cell contact for high volume production of low cost silicon solar arr...
Electrodes made with pastes produced under the previous contract were analyzed and compared with raw...
Silicon nitride and nickel pastes are investigated in conjunction with a brush copper plating proces...
Improved thick film solar cell contacts for the high volume production of low cost silicon solar arr...
AbstractThe screen printing metallization of p+ surfaces is one of the challenges for the industrial...
The experimental work demonstrating the feasibility of the MIDFILM process as a low cost means of ap...
A low cost ohmic contact on silicon solar cells based on molybdenum-tin metal systems was developed....
Printed nickel overplated with copper and applied on top of a predeposited silicon nitride antirefle...
AbstractThis work deals with requirements regarding the solar cell process that allow or facilitate ...