Advanced thermal energy management: A thermal test bed and heat pipe simulation

Work initiated on a common-module thermal test simulation was continued, and a second project on heat pipe simulation was begun. The test bed, constructed from surplus Skylab equipment, was modeled and solved for various thermal load and flow conditions. Low thermal load caused the radiator fluid, Coolanol 25, to thicken due to its temperature avoided by using a regenerator-heat-exchanger. Other possible solutions modeled include a radiator heater and shunting heat from the central thermal bus to the radiator. Also, module air temperature can become excessive with high avionics load. A second preoject concerning advanced heat pipe concepts was initiated. A program was written which calculates fluid physical properties, liquid and vapor pressure in the evaporator and condenser, fluid flow rates, and thermal flux. The program is directed to evaluating newer heat pipe wicks and geometries, especially water in an artery surrounded by six vapor channels. Effects of temperature, groove and slot dimensions, and wick properties are reported