Some of the advanced thermal management techniques used to reduce operating junction temperature under extreme environmental temperature conditions are discussed. Heat pipes in actual electronic packaging applications, and those under development, are discussed. Performance characteristics of heat pipes are given, and examples are described of how thermal problems in electronic packaging are solved through the use of heat pipes
A novel and new thermal management technology for advanced ceramic microelectronic packages has been...
Small Business Innovation Research contracts from Goddard Space Flight Center to Thermacore Inc. hav...
The rapid developments in electronics and semiconductors processing led to the use of very compact a...
Due to the character of the original source materials and the nature of batch digitization, quality ...
Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini ...
This paper presents a feasibility study to improve thermal loading of existing radioactive material ...
In electrical and electronic industry due to miniaturization of electronic components heat density i...
A novel, integrated approach in thermal management of electronic products, based on two-phase coolin...
In almost all industrial electronic applications, the use of PCB is indispensable. Indubitably, it w...
A novel and new thermal management technology for advanced ceramic microelectronic packages has been...
Heat pipes are becoming increasingly popular as passive heat transfer technologies due to their high...
The heat pipe and thermosyphon are passive heat transfer devices with phase change, which can be app...
Heat pipe is used in the primary heat exchanger for nuclear power plants, as a heat sink for high-po...
A novel and new thermal management technology for advanced ceramic microelectronic packages has been...
A novel and new thermal management technology for advanced ceramic microelectronic packages has been...
A novel and new thermal management technology for advanced ceramic microelectronic packages has been...
Small Business Innovation Research contracts from Goddard Space Flight Center to Thermacore Inc. hav...
The rapid developments in electronics and semiconductors processing led to the use of very compact a...
Due to the character of the original source materials and the nature of batch digitization, quality ...
Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini ...
This paper presents a feasibility study to improve thermal loading of existing radioactive material ...
In electrical and electronic industry due to miniaturization of electronic components heat density i...
A novel, integrated approach in thermal management of electronic products, based on two-phase coolin...
In almost all industrial electronic applications, the use of PCB is indispensable. Indubitably, it w...
A novel and new thermal management technology for advanced ceramic microelectronic packages has been...
Heat pipes are becoming increasingly popular as passive heat transfer technologies due to their high...
The heat pipe and thermosyphon are passive heat transfer devices with phase change, which can be app...
Heat pipe is used in the primary heat exchanger for nuclear power plants, as a heat sink for high-po...
A novel and new thermal management technology for advanced ceramic microelectronic packages has been...
A novel and new thermal management technology for advanced ceramic microelectronic packages has been...
A novel and new thermal management technology for advanced ceramic microelectronic packages has been...
Small Business Innovation Research contracts from Goddard Space Flight Center to Thermacore Inc. hav...
The rapid developments in electronics and semiconductors processing led to the use of very compact a...