In the Get Away Special 330 payload two germanium samples doped with gallium will be processed. The aim of the experiments is to create a planar solid/liquid interface, and to study the breakdown of this interface as the crystal growth rate increases. For the experiments a gradient furnace was designed which is heated by resistive heaters. Cooling is provided by circulating gas from the atmosphere in the cannister through cooling channels in the furnace. The temperature along the sample are measured by platinum/rhodium thermocouples. The furnace is controlled by a microcomputer system, based upon the processor 80C88. A data acquisition system is integrated into the system. In order to synchronize the different actions in time, a multitask m...
A study on the gas ambient (varying percent 02 flow) and gap spacing (distance between the target an...
Resonant Interband Tunnel Diodes (RITD) with device sizes ranging from r=20μm to r=50nm (mask define...
Process technology for integrated circuit fabrication continues to change and an efficient simulatio...
The thesis uses surface science techniques to characterise the chemical composition and electronic p...
A simple, MEMS base micro-chemical detector utilizing the principles of gas ionization, has been des...
KTI-820, a positive photoresist was hardened utilizing two different methods. The PRIST technique in...
As device scaling is an ever present concern in semiconductor manufacturing, the need for thin, conf...
A surface micromachined MEMS gas flow sensor has been fabricated and tested. The fabrication process...
This work presents the analysis and development of a low cost GSM telephone system. A review of rad...
A study has been performed to investigate oxynitrides as thin gate dielectrics. The method of nitrid...
Research and pilot line production efforts directed towards the fabrication of high efficiency ultra...
Depending on the size and geometry, laser-microfabricated structures in transparent materials have a...
The transition-piece of an aero-derivative gas turbine engine transfers high temperature combusted g...
Luminosity measurements at the high luminosity points of the LHC are very challenging due to the ext...
The objective of this project was to investigate the possibility of producing array of microplasma, ...
A study on the gas ambient (varying percent 02 flow) and gap spacing (distance between the target an...
Resonant Interband Tunnel Diodes (RITD) with device sizes ranging from r=20μm to r=50nm (mask define...
Process technology for integrated circuit fabrication continues to change and an efficient simulatio...
The thesis uses surface science techniques to characterise the chemical composition and electronic p...
A simple, MEMS base micro-chemical detector utilizing the principles of gas ionization, has been des...
KTI-820, a positive photoresist was hardened utilizing two different methods. The PRIST technique in...
As device scaling is an ever present concern in semiconductor manufacturing, the need for thin, conf...
A surface micromachined MEMS gas flow sensor has been fabricated and tested. The fabrication process...
This work presents the analysis and development of a low cost GSM telephone system. A review of rad...
A study has been performed to investigate oxynitrides as thin gate dielectrics. The method of nitrid...
Research and pilot line production efforts directed towards the fabrication of high efficiency ultra...
Depending on the size and geometry, laser-microfabricated structures in transparent materials have a...
The transition-piece of an aero-derivative gas turbine engine transfers high temperature combusted g...
Luminosity measurements at the high luminosity points of the LHC are very challenging due to the ext...
The objective of this project was to investigate the possibility of producing array of microplasma, ...
A study on the gas ambient (varying percent 02 flow) and gap spacing (distance between the target an...
Resonant Interband Tunnel Diodes (RITD) with device sizes ranging from r=20μm to r=50nm (mask define...
Process technology for integrated circuit fabrication continues to change and an efficient simulatio...