The current work investigates the characterization of copper-zinc-graphene nanoflakes (Cu-35Zn-GNF) system prepared by powder metallurgy (PM). Since GNF is a rising new material and lack research information, meanwhile leaded brass is a less preferable option, therefore GNF was used as reinforcement in brass. So, Cu-35Zn-xGNF (where x= 0, 0.1, 0.3 and 0.5 wt%) was prepared by ball milling method. Effects of different milling time (20, 40 and 60 h) and different composition of GNF (0, 0.1, 0.3 and 0.5 wt%) in the composite system were investigated. Elemental powders Cu, Zn and GNF were milled with speed 250 rpm and with ball-to-powder ratio of 10:1. Next, all the composites were compacted with 500 MPa of force. XRD peaks of 60 h milling time...
Copper/graphene nanoplatelet (GNP) nanocomposites were produced by a wet mixing method followed by ...
Copper/graphene nanoplatelet (GNP) nanocomposites were produced by a wet mixing method followed by a...
The current development of the electronics system requires capabilities beyond conventional heat tra...
Room-temperature ball milling technique has been successfully employed to fabricate copper-zinc grap...
In this study, the effect of milling speed and compaction pressure on the densification and morpholo...
In recent years, nano-scale graphene (Gn) has generated a lot of interest owing to its remarkable ch...
In recent years, nano-scale graphene (Gn) has generated a lot of interest owing to its remarkable ch...
In recent years, nano-scale graphene (Gn) has generated a lot of interest owing to its remarkable ch...
Cu-Zn nanocomposite is known to have good corrosion resistance, low cost manufacturing, good machina...
In this research, copper nanocomposites reinforced by graphene nanoplatelets (GNPs) were fabricated ...
This study evaluated the effect of milling speed and compaction pressure on the densification and mo...
Classical powder metallurgy followed by either hot isostatic pressing (HIPing) or repressing-anneali...
Graphene nanoplatelets (GNPs)/copper composites has been prepared by conventional powder metallurgy....
The compressibility of a copper matrix reinforced with different weight percentages of graphene nano...
Classical powder metallurgy followed by either hot isostatic pressing (HIPing) or repressing–anneali...
Copper/graphene nanoplatelet (GNP) nanocomposites were produced by a wet mixing method followed by ...
Copper/graphene nanoplatelet (GNP) nanocomposites were produced by a wet mixing method followed by a...
The current development of the electronics system requires capabilities beyond conventional heat tra...
Room-temperature ball milling technique has been successfully employed to fabricate copper-zinc grap...
In this study, the effect of milling speed and compaction pressure on the densification and morpholo...
In recent years, nano-scale graphene (Gn) has generated a lot of interest owing to its remarkable ch...
In recent years, nano-scale graphene (Gn) has generated a lot of interest owing to its remarkable ch...
In recent years, nano-scale graphene (Gn) has generated a lot of interest owing to its remarkable ch...
Cu-Zn nanocomposite is known to have good corrosion resistance, low cost manufacturing, good machina...
In this research, copper nanocomposites reinforced by graphene nanoplatelets (GNPs) were fabricated ...
This study evaluated the effect of milling speed and compaction pressure on the densification and mo...
Classical powder metallurgy followed by either hot isostatic pressing (HIPing) or repressing-anneali...
Graphene nanoplatelets (GNPs)/copper composites has been prepared by conventional powder metallurgy....
The compressibility of a copper matrix reinforced with different weight percentages of graphene nano...
Classical powder metallurgy followed by either hot isostatic pressing (HIPing) or repressing–anneali...
Copper/graphene nanoplatelet (GNP) nanocomposites were produced by a wet mixing method followed by ...
Copper/graphene nanoplatelet (GNP) nanocomposites were produced by a wet mixing method followed by a...
The current development of the electronics system requires capabilities beyond conventional heat tra...