Thermal enclosures for electronically scanned pressure modules operating in cryogenic environments

Specific guidelines to design, construct, and test ESP thermal enclosures for applications at cryogenic temperatures are given. The enclosures maintain the ESP modules at a constant temperature (10 C plus or minus 1 C) to minimize thermal zero and sensitivity shifts, to minimize the frequency of expensive on-line calibrations, and to avoid adverse effects on tunnel and model boundary layers. The enclosures are constructed of a rigid closed-cell foam and are capable of withstanding the stagnation pressures to 932kPa (135 psia) without reduction in thermal insulation properties. This construction procedure has been used to construct several thermal packages which have been successfully used in National Transonic Facility